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Encapsulant

Encapsulant news and technical articles from Solid State Technology Magazine. Search Encapsulant latest and archived news and articles

  1. Silicone encapsulant from Wacker flexes with thin film PV

    Article

    Thu, 11 Aug 2011

    WACKER introduced a solar cell silicone encapsulant that laminates flexible thin-film ..... solar cell makers to apply the silicone encapsulant , feed the front film and vulcanize ..... company also makes ELASTOSIL Solar 2120 UV encapsulant . Learn more at www.wacker.com

  2. LORD underfill encapsulant designed for lower cost

    Article

    Wed, 15 Jun 2011

    and encapsulants supplier, launched the ME-555 underfill encapsulant for semiconductor packaging and assembly . LORD ME- 555 is ..... full coverage without bulky fillets or creeping on top. The encapsulant is designed to flow consistently at a fast rate without voids

  1. Nitto Denko transfers semiconductor encapsulant business to Hitachi Chemical

    Article

    Thu, 3 May 2012

    deal was first brokered in March 2012. The semiconductor encapsulant business, excluding optoelectronics encapsulants, is focused ..... Resources previously associated with the semiconductor encapsulant business will be applied to other product businesses for

  2. Behind Dow Corning, Reis Robotics' liquid PV encapsulant process

    Article

    Tue, 30 Aug 2011

    available for commercial use. The new technology enables solar panel manufacturers to use Dow Corning's PV-6100 cell encapsulant series and Reis' equipment to achieve higher production rates for crystalline and amorphous silicon thin-film modules

  3. Faster solar module lamination with DuPont, Burkle pairing

    Article

    Wed, 5 Oct 2011

    optimized with DuPont's PV5400 Series encapsulant . Also read: DuPont's PV mission ..... engineer. DuPont's ionomer-based encapsulant has faster de-airing time and better ..... during lamination. In addition, the encapsulant from DuPont demonstrates resistance

  4. Zymet PoP underfill offers lower viscosity, CTE for finer pitches

    Article

    Wed, 11 Jan 2012

    January 11, 2012 -- Zymet introduced the CN-1736 reworkable underfill encapsulant for 0.4mm-pitch package-on-package (PoP) assemblies. Figure. Void-free underfill of 0.4-mm pitch POP with CN

  5. FSLR inaugurates first class of top suppliers

    Article

    Tue, 10 Jan 2012

    First Solar's inaugural crop of top-ranked suppliers includes an encapsulant firm, a thin-film line builder, and a shipping specialist.

  6. Dow Corning, Reis claim silicone-based PV encapsulation saves footprint, ramps throughput

    Article

    Thu, 25 Aug 2011

    Dow Corning Corp. and Reis Robotics launched a solar cell liquid encapsulation process based on silicone encapsulant , which uses lower processing temperatures and a smaller factory-floor footprint than traditional technologies.

  7. Solar photovoltaics polymers trends

    Article

    Tue, 21 Jun 2011

    demands on materials will be high: encapsulant would need to be highly transparent ..... durability of a module is linked to the encapsulant , and each material has advantages and ..... considerations for the extrusion of encapsulant polymers, as studied by Davis-Standard

  8. Shin-Etsu Chemical releases low-RI LED encapsulants

    Article

    Fri, 17 Feb 2012

    material that is characterized by low gas permeability. The encapsulant targets low gas permeability, good photo-thermal stability ..... to light-intensity degradation. The highly transparent encapsulant suits flat-package HB-LEDs. KER-7000 materials' heat

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