DUT
DUT news and technical articles from Solid State Technology Magazine. Search DUT latest and archived news and articles
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MicroProbe debuts MEMS-based, multi-DUT , ultra-fine-pitch probe card for IC wafer test
… for probing multiple devices under test ( DUT ) in high-volume semiconductor production ..... opportunities for pad-limited devices. Multi- DUT testing is seeing increasing use as a means ..... requirements increase in frequency in multi- DUT environments which hinders production uptime …
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Antares Advanced Test, IC Test Lab Partner on DUT -level Qual Burn-in
(February 22, 2008) Santa Clara, CA Antares Advanced Test Technologies and an undisclosed IC test lab in the Silicon Valley have partnered to configure a burn-in chamber at the test lab with Antares' iSocket thermal-management technology to allow semiconductor engineers in the region to conduct
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Understanding tester interfaces
… classes of problems with the test cell and DUT interface: impedance mismatches, crosstalk ..... classes of problems with the test cell and DUT interface: impedance mismatches, crosstalk ..... head, load board, test socket, and auto DUT handler. If the signal path had only one …
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Aries Adds CSP Optical FA Test Sockets for EMMI or Optical Sensor Applications
… optically exposes 100% of the top of the device under test ( DUT ) for failure analysis (FA) testing for emission microscopy ..... the socket lid only exposes a maximum of 85% of the top of the DUT surface. Available with or without filters for UV, infrared …
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What is guard band?
… banding guarantees that the device under test ( DUT ) is within specifications, even if the measurement ..... timeline: The three values shown are the DUT timing specifications for a given timing parameter. The DUT specification sheet guarantees that this timing …
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FormFactor releases probe cards
August 9, 2003 - FormFactor, Livermore, CA, has begun production of its 253 DUT wafer test system, a large-area array probe card aimed at 300mm DRAM manufacturers. The array can test 253 devices per touchdown, thanks to proprietary interconnect technology and design tools.
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Integrated handler and tester workcell
… Centaur system workcell combines a high-performance logic test system and a high-throughput handler with automated docking and DUT interface. It also offers the optional capability of performing device lead and mark inspection, and has remote debug and diagnostic …
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Thermal control system
… microprocessors and system-on-chip ASICs. As power densities increase above 10 W/cm2, the effectiveness of response to changes in DUT dynamic power can diminish quickly. The ETC 1000 is not limited by this power density barrier. It offers ? 2?C junction temperature …
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Keithley Avoid wafer test probe set up cabling errors
… be a problem when the device under test ( DUT ) impedance is similar to that of the various ..... measure unit (SMU), is connected to the DUT using a coaxial cable. In Figure 1, a ..... the sum of the current flowing through the DUT (I DUT ) and the leakage current, rather than …
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IC Sockets:
… compartments for trays where devices under test ( DUT ) are stored. A vacuum head/plunger inside the handler will pick up the DUT and push it inside the test socket while ..... socket is the final link between ATE and DUT . A typical test socket consists of contacts …
