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packaging for MEMS; Plasma etch challenges (profile control, feature level uniformity, plasma microdamage); a dry etching process for phase-change memory; selective etch processes for magnetic materials (Ni, Co, Ta) High- k dielectrics
provides scientists from IBM and ETH Zurich with a flexible environment and tools for lithography, wet processing, dry etching , thermal processes, thin-film deposition or metrology and characterization. The cleanroom also features a special