Diffusion Barriers
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Conference Report: MRS Spring 2012, Day 3
… energy storage and conversion, Mn capping layers and diffusion barriers , hard masks for Cu interconnects, nanogenerators ..... Gordon of Harvard U spoke on Mn capping layers and diffusion barriers in copper interconnects for TSV and on-chip vias …
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Wafer bonding enables better LEDs with right process and materials
… layers such as platinum, aluminum, and gold, or combinations of these materials, are used. Next, adhesion and diffusion barriers have to be chosen to contain the diffusive metals from the injection contacts or mirror layer of the LED structure …
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Empa's flexible CIGS approaches Si, CIGS/glass mark
… during the final growth stage. Efficiencies of 17.5% had been achieved on steel foils covered with impurity diffusion barriers using higher-temperature (>550°C) processes; the new low-temp process on the same steel foil without a …
