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sizes continue to shrink, anisotropic dielectric etching faces a daunting list of challenges ..... helping to enable anisotropic etching of dielectric materials. The transition to 193nm ..... more stringent requirements for the dielectric -to-resist etch selectivity. Dielectric
Transitions in polymer mechanical and dielectric properties accompany glass transition ..... here to enlarge image When choosing a dielectric material, there are various factors ..... packaging designer should consider. Dielectric dissipation and partial discharge of
Coast Editor The wide variety of low- k dielectric materials and processes for ULSI interconnection ..... generic cost-per-wafer (CPW) model for dielectric deposition (not including the costs of dielectric CMP, metallization, or lithography
Low-k dielectric materials and processes for ULSI interconnection ..... to a generic cost-per-wafer (CPW) model for dielectric deposition (not including the costs of dielectric CMP, metallization, or lithography). Despite
silicate glass (OSG) based low- k dielectric materials are widely used to minimize ..... in the degradation of the film’s dielectric properties as well as other issues such ..... for repairing carbon damaged low- k dielectric materials is through the use of a silylation
challenges to the integration of high-k dielectric materials. The hydroxyl ion, OH ..... prevailing impurity in H 2 O-based high-k dielectric films and a major source of fixed and ..... is below 10 -7 A/cm 2 , a high-k dielectric film — one which is thermally stable and
Understanding hydrogen silsesquioxane-based dielectric film processing Mark J. Loboda, George ..... HSQ-based films routinely provide dielectric constants lower than PECVD silicon dioxide ..... In addition, HSQ offers a lower dielectric constant (k <3.0) than standard
modification technology for advanced dielectric applications. As a post-deposition process, UVTP enhances dielectric film properties by combining UV photon ..... strength and adhesion of low- k dielectric films. To improve device performance
overview The integration of low- k dielectric materials has proven to be a significant ..... at least several years. Figure 1. Dielectric etch process for a) subtractive aluminum ..... copper dual damascene. The barrier dielectric is removed following stripping of PR
Dielectric antireflective coatings for DUV lithography ..... chemical vapor deposition (PECVD) dielectric antireflective coatings (ARC) can ..... applications. This paper demonstrates how a dielectric ARC was designed for aluminum metallization