Die Bonder news and technical articles from Solid State Technology Magazine. Search Die Bonder latest and archived news and articles
Technologies introduced the fully automated 3800 Ultra Flexible Die Bonder , created for flexibility, high accuracy and precision ..... is based on Palomar's three-generation Model 3500 Die Bonder . The 3.5 um repeatability 3 sigma and 2600 UPH over
Automatic smart card die bonder Die Bonder SMART is an automatic, continuous tape die bonder for smart card assembly that provides up to 4000
Die bonder and component placer The T-3102 die bonder , which can be changed from manual operation to fully automatic at the touch of a switch, removes die by pulling down the foil while the die, supported by the fixed needle, remains stationary
Die bonder Model 4500 is a multichip epoxy die bonder that features dispensing and stamping capability, multiple stamping, pick-and-place and eject tools, die input from frames, rings, waffle or Gel-Packs, 8-in. wafer handling, standard
Die bonder The Dr. Tresky T-3002 manual die bonder and component placer separates the die from the foil by pull down of the foil. The die is supported by the fixed ejector needle and remains stationary, which reduces the risk of surface damage
Epoxy die bonder System 110 epoxy die bonder uses a programmable XY stage for die placement. The built-in 10:1 XY-? manipulator allows die alignment to better than 10 ?m. Multiple die types can be programmed into multiple substrate arrays
February 15, 2012 -- Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER
Kulicke & Soffa Industries Inc. says it is entering the die bonder market with an agreed-upon $30 million acquisition ..... S marketed Datacon's multichip module and flip chip die bonder product line worldwide, excluding Europe.
Multichip die bonder The PPS 2200 series die bonder offers totally modular hardware and software for multichip applications. It may consist of between one and four modules of identical design. Arranged in a line, they are capable of assembling
The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.