Die Bonder
Die Bonder news and technical articles from Solid State Technology Magazine. Search Die Bonder latest and archived news and articles
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Universities: Enter to win a Finetech die bonder
February 15, 2012 -- Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER …
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Robotic die bonder upgrades SET packaging platform
The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.
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Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop
January 18, 2011 -- Die bonder supplier Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding …
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Henkel power package sintering technology shuns Pb, pressure processing
… particles are joined via a unique surface tension mechanism. This eliminates single-package processing in a dedicated die bonder ; the material can be cured in a standard batch oven at 200C or higher. Ablestik SSP2000 can be processed on standard …
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SEMICON West 2011: New product roundup
… surface tension mechanism, thus avoiding pressure processing and eliminating single-package processing in a dedicated die bonder ; the material can be cured in a standard batch oven at 200C or higher. Ablestik SSP2000 can be processed on standard …
