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Die Bonder

Die Bonder news and technical articles from Solid State Technology Magazine. Search Die Bonder latest and archived news and articles

  1. Universities: Enter to win a Finetech die bonder

    Article

    Wed, 15 Feb 2012

    February 15, 2012 -- Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER

  2. Robotic die bonder upgrades SET packaging platform

    Article

    Fri, 8 Jul 2011

    The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to-chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes, with a robotic handling system for fragile and diverse substrates/wafers.

  1. Hesse & Knipps discusses wedge bonding for RF and microwave devices at workshop

    Article

    Wed, 18 Jan 2012

    January 18, 2011 -- Die bonder supplier Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Wedge Bonding

  2. Henkel power package sintering technology shuns Pb, pressure processing

    Article

    Wed, 13 Jul 2011

    particles are joined via a unique surface tension mechanism. This eliminates single-package processing in a dedicated die bonder ; the material can be cured in a standard batch oven at 200C or higher. Ablestik SSP2000 can be processed on standard

  3. SEMICON West 2011: New product roundup

    Article

    Wed, 27 Jul 2011

    surface tension mechanism, thus avoiding pressure processing and eliminating single-package processing in a dedicated die bonder ; the material can be cured in a standard batch oven at 200C or higher. Ablestik SSP2000 can be processed on standard

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