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Die Attach Film

Die Attach Film news and technical articles from Solid State Technology Magazine. Search Die Attach Film latest and archived news and articles

  1. WLCSP QFN ELP Semiconductor packaging for consumer applications

    Online Articles

    Wed, 12 Jan 2011

    further reduce package size. Active leads can be placed underneath the die, attached by non-conductive epoxy or die attach film (DAF). 52 lead - 4.5x7mm form factor 52 lead – 4x4.5mm form factor Leadframe internal design Front of line

  2. SEMI: Materials bounce back to records, but slowing in 2010

    Online Articles

    Tue, 13 Jul 2010

    Assume gold value of $660/trz for 2007, $872/trz for 2008, $920 for 2009-2011 forecast period 3 Includes die attach film (tape) materials 4 Other includes solder balls and wafer level package dielectrics By region, Japan remains the

  3. Self-filleting technology using smart die-attach paste

    Magazine Articles

    Tue, 1 Sep 2009

    technologies. Figure 4. Self-filleting paste has been used successfully on many applications as an alternative to die attach film adhesives. Click here to enlarge image To facilitate the stacking of die for more applications such as memory, traditional

  4. RoHS, device shrinks will continue to drive packaging technology

    Online Articles

    Tue, 11 Jan 2011

    innovation to address these new requirements. New die attach film materials with thicknesses as thin as 5μm are enabling ..... stacking processes. In fact, for many applications, die attach film will be the only die attach option as traditional die

  5. Wafer Dicing: A Sticky Situation

    Magazine Articles

    Thu, 1 Mar 2007

    AI Technology, Inc. manufactures a dicing and die - attach film (DDAF) that combines high-temperature, antistatic ..... markets. Figure 4. This combination dicing tape and die - attach film is available in control- and UV-release varieties. Click

  6. New Products

    Magazine Articles

    Thu, 1 Nov 2007

    enlarge image The Hysol QMI5100 and Hysol QMI5200 dicing die attach film products are designed to streamline the die attach ..... formulations combine the properties and functions of die attach film and dicing tape into one product. With these dual

  7. Using Lasers to Dice Thin Silicon Wafers

    Magazine Articles

    Tue, 1 Apr 2008

    saws encounter issues — primarily low die strength and decreasing machining speed. Singulation of die mounted on die - attach film (DAF) also proves challenging for traditional methods. Laser-based technologies offer efficient solutions for

  8. Upcoming Events

    Online Articles

    Tue, 17 Oct 2006

    Jose, CA. A family of self-filleting die-attach paste adhesives, AAA3300, offers properties comparable to die - attach film . The adhesive is said to enable thin-die assembly at improved yields with conventional assembly techniques, and

  9. How 3D is Stacking Up

    Magazine Articles

    Wed, 1 Oct 2008

    here to enlarge image Figure 1 shows an offset stack of eight die, each about 40μm thick, separated by 10μm thick die - attach film . They are connected to each other and to the substrate by the conductive polymer columns. The horizontal offset

  10. Who’s Who at SEMICON Europa

    Magazine Articles

    Thu, 1 Nov 2007

    business manager for the company’s European semiconductor division, talked about their non-conductive adhesive die - attach film , which combines dicing and die attach processes into one product, thereby enabling stacked-die applications

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