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Die Attach Film

Die Attach Film news and technical articles from Solid State Technology Magazine. Search Die Attach Film latest and archived news and articles

  1. Henkel Electronic Materials pre-cuts die attach film for 150mm, 200mm wafers

    Online Articles

    Mon, 30 Jul 2012

    Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm ..... cut film joins LOCTITE ABLESTIK C100, a conductive die attach film in roll format . Conductive die attach films enable

  2. Henkel conductive die attach film for thin die advanced packages

    Online Articles

    Mon, 28 Mar 2011

    strength, allowing robust adhesion against moisture and MSL Level 2 performance on all leadframe surface finishes. Die attach film provides process control and reliability, especially with thinner wafers, said Kevin Becker, Henkel director of

  1. Henkel develops die attach film for leadframe packages

    Online Articles

    Wed, 13 Jul 2011

    Packaging materials supplier Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die

  2. Hitachi Chemical Henkel die attach film license

    Online Articles

    Sun, 13 Feb 2011

    the worldwide manufacture and sales of certain dicing die attach film . In this agreement, Hitachi Chemical has granted ..... counterpart patents to manufacture and sell dicing die attach film . Henkel operates worldwide with leading brands and

  3. Die-attach Paste

    Online Articles

    Tue, 17 Oct 2006

    A family of self-filleting die-attach paste adhesives, AAA3300, offers properties comparable to die - attach film . The adhesive is said to enable thin-die assembly at improved yields with conventional assembly techniques, and exhibits capillary flow to 100% die coverage in specified temperature ...

  4. Enabling Next-generation Stacked-die Applications

    Magazine Articles

    Tue, 1 Apr 2008

    provide to ultra-thin wafers. Die - attach film (DAF) technologies in the form ..... induced by the standard process. Die - attach Film Process Advantages For high ..... die stacks. Currently, two die - attach film materials are delivering promising

  5. Henkel debuts automotive sensor packaging adhesive

    Online Articles

    Wed, 2 Nov 2011

    maintaining the bond and electrical interconnect between the component and the leadframe. Also read: Henkel develops die attach film for leadframe packages The adhesive, as well as lead-free solders and new underfill products, among others, will

  6. SEMICON West 2011: New product roundup

    Online Articles

    Wed, 27 Jul 2011

    Henkel (with STMicroelectronics) has developed a ScalPack die placement process using its Ablestik C100 conductive die attach film materials for production of very small package configurations, to increase workability in leadframe packaging (over

  7. Recession as the mother of innovation

    Magazine Articles

    Mon, 1 Feb 2010

    downturn, for example, development of traditional die attach film products essential for current end user applications ..... packages, for instance—development of a conductive die attach film that offers electrical properties similar to those

  8. Executive viewpoints: The recovery has arrived!

    Magazine Articles

    Fri, 1 Jan 2010

    is also in development to meet the requirements of advanced die stacking applications not conducive to traditional die attach film processes. Products for robust photovoltaic production have also been central to our innovation efforts and long

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