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Die Attach Film

Die Attach Film news and technical articles from Solid State Technology Magazine. Search Die Attach Film latest and archived news and articles

  1. Henkel develops die attach film for leadframe packages

    Article

    Wed, 13 Jul 2011

    Packaging materials supplier Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die

  2. Henkel debuts automotive sensor packaging adhesive

    Article

    Wed, 2 Nov 2011

    maintaining the bond and electrical interconnect between the component and the leadframe. Also read: Henkel develops die attach film for leadframe packages The adhesive, as well as lead-free solders and new underfill products, among others, will

  1. SEMICON West 2011: New product roundup

    Article

    Wed, 27 Jul 2011

    Henkel (with STMicroelectronics) has developed a ScalPack die placement process using its Ablestik C100 conductive die attach film materials for production of very small package configurations, to increase workability in leadframe packaging (over

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