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Packaging materials supplier Henkel worked with STMicroelectronics (STM) to qualify Henkel's Ablestik C100 conductive die attach film materials for production of very small package configurations in a process called ScalPack, which incorporates die
maintaining the bond and electrical interconnect between the component and the leadframe. Also read: Henkel develops die attach film for leadframe packages The adhesive, as well as lead-free solders and new underfill products, among others, will
Henkel (with STMicroelectronics) has developed a ScalPack die placement process using its Ablestik C100 conductive die attach film materials for production of very small package configurations, to increase workability in leadframe packaging (over