Die Attach Equipment news and technical articles from Solid State Technology Magazine. Search Die Attach Equipment latest and archived news and articles
Substantial amounts of electrostatic discharge (ESD) damage are not only possible, but probable in semiconductor die attach operations, leading to substantial yield losses. Roger Peirce and Brad Williford from Simco illustrate seven distinct mechanisms in typical die attach operations that cause ...
saws from Disco and TSK, citing capabilities, quality and efficiency. At die attach , new Shinkawa and Esec die attach equipment will be added. Iconn wire bonders from Kulicke & Soffa will expand Signetics’ capacity for palladium-coated
to register for the drawing, visit http://www.finetechusa.com/bonders/products/promotion.html . Finetech manufactures manual and fully automatic component rework and high-precision bonding and die attach equipment .
has significant ramifications in the performance, reliability and the cost of the package. Some of the common die attach equipment available in the market today are supplied by ASM, Datacon, ESEC, K&S and NEC. There are various options
the development required for new device combinations. Amkor Technology, Chandler, Ariz., www.amkor.com. DIE ATTACH EQUIPMENT & MATERIALS HANDLING EQUIPMENT / FIXTURES Die Feeder Click here to enlarge image The DDf Ultra feeds a wide range
transfer. The system requires no complex plating. SUSS MicroTec, Inc. , Waterbury Center, VT, www.suss.com Die Attach Equipment & Materials DirEKt Coat consists of a micron-class mass-imaging system, ultra-flat pallet, die-attach
connections between stacked devices. Surface Technology Systems plc, Newport, Wales, www.stssystems.com. DIE ATTACH EQUIPMENT & MATERIALS Die Bonder Click here to enlarge image The 2200 evo handles up to 25 300-mm wafers on less than 1
source to be placed remotely to minimize heating effects. Ultratech , San Jose, CA, www.ultratech.com. DIE - ATTACH EQUIPMENT & MATERIALS Inline Die-bonder Platform The AD8912 inline die-bonder consists of three major modules: the
recognition system, and post-bond inspection. Datacon Technology GmbH, Radfeld, Austria www.datacon.at Die - attach Equipment and Materials Click here to enlarge image Automatic Multi-chip Modules Bonder The latest generation large
combination of silicon image sensor and LED light source. Ultratech , San Jose, CA, www.ultratech.com. DIE - ATTACH EQUIPMENT & MATERIALS Inline Die-bonder Platform The AD8912 inline die bonder consists of three major modules: the CPS12