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Die Attach Equipment

Die Attach Equipment news and technical articles from Solid State Technology Magazine. Search Die Attach Equipment latest and archived news and articles

  1. Die attach equipment and ESD

    Online Articles

    Wed, 17 Mar 2010

    Substantial amounts of electrostatic discharge (ESD) damage are not only possible, but probable in semiconductor die attach operations, leading to substantial yield losses. Roger Peirce and Brad Williford from Simco illustrate seven distinct mechanisms in typical die attach operations that cause ...

  2. Signetics bolsters mobile chip packaging capacity with large tool buy

    Online Articles

    Tue, 19 Jun 2012

    saws from Disco and TSK, citing capabilities, quality and efficiency. At die attach , new Shinkawa and Esec die attach equipment will be added. Iconn wire bonders from Kulicke & Soffa will expand Signetics’ capacity for palladium-coated

  1. Universities: Enter to win a Finetech die bonder

    Online Articles

    Wed, 15 Feb 2012

    to register for the drawing, visit http://www.finetechusa.com/bonders/products/promotion.html . Finetech manufactures manual and fully automatic component rework and high-precision bonding and die attach equipment .

  2. Manufacturing challenges with plastic overmolded packages

    Magazine Articles

    Wed, 1 Jul 2009

    has significant ramifications in the performance, reliability and the cost of the package. Some of the common die attach equipment available in the market today are supplied by ASM, Datacon, ESEC, K&S and NEC. There are various options

  3. 2005 Advanced Packaging Awards

    Magazine Articles

    Thu, 1 Sep 2005

    the development required for new device combinations. Amkor Technology, Chandler, Ariz., www.amkor.com. DIE ATTACH EQUIPMENT & MATERIALS HANDLING EQUIPMENT / FIXTURES Die Feeder Click here to enlarge image The DDf Ultra feeds a wide range

  4. Advanced Packaging Awards 2006

    Magazine Articles

    Fri, 1 Sep 2006

    transfer. The system requires no complex plating. SUSS MicroTec, Inc. , Waterbury Center, VT, www.suss.com Die Attach Equipment & Materials DirEKt Coat consists of a micron-class mass-imaging system, ultra-flat pallet, die-attach

  5. Advanced Packaging Awards Entry Showcase

    Magazine Articles

    Sat, 1 Jul 2006

    connections between stacked devices. Surface Technology Systems plc, Newport, Wales, www.stssystems.com. DIE ATTACH EQUIPMENT & MATERIALS Die Bonder Click here to enlarge image The 2200 evo handles up to 25 300-mm wafers on less than 1

  6. The APAs: Honoring Industry Innovation

    Magazine Articles

    Wed, 1 Aug 2007

    source to be placed remotely to minimize heating effects. Ultratech , San Jose, CA, www.ultratech.com. DIE - ATTACH EQUIPMENT & MATERIALS Inline Die-bonder Platform The AD8912 inline die-bonder consists of three major modules: the

  7. Advanced Packaging Awards 2008: Signs of Hope

    Magazine Articles

    Fri, 1 Aug 2008

    recognition system, and post-bond inspection. Datacon Technology GmbH, Radfeld, Austria www.datacon.at Die - attach Equipment and Materials Click here to enlarge image Automatic Multi-chip Modules Bonder The latest generation large

  8. 2007 Finalist Showcase

    Magazine Articles

    Sun, 1 Jul 2007

    combination of silicon image sensor and LED light source. Ultratech , San Jose, CA, www.ultratech.com. DIE - ATTACH EQUIPMENT & MATERIALS Inline Die-bonder Platform The AD8912 inline die bonder consists of three major modules: the CPS12

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