Die Attach Equipment
Die Attach Equipment news and technical articles from Solid State Technology Magazine. Search Die Attach Equipment latest and archived news and articles
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Die attach equipment and ESD
Substantial amounts of electrostatic discharge (ESD) damage are not only possible, but probable in semiconductor die attach operations, leading to substantial yield losses. Roger Peirce and Brad Williford from Simco illustrate seven distinct mechanisms in typical die attach operations that cause ...
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Signetics bolsters mobile chip packaging capacity with large tool buy
… saws from Disco and TSK, citing capabilities, quality and efficiency. At die attach , new Shinkawa and Esec die attach equipment will be added. Iconn wire bonders from Kulicke & Soffa will expand Signetics’ capacity for palladium-coated …
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Universities: Enter to win a Finetech die bonder
… to register for the drawing, visit http://www.finetechusa.com/bonders/products/promotion.html . Finetech manufactures manual and fully automatic component rework and high-precision bonding and die attach equipment .
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Manufacturing challenges with plastic overmolded packages
… has significant ramifications in the performance, reliability and the cost of the package. Some of the common die attach equipment available in the market today are supplied by ASM, Datacon, ESEC, K&S and NEC. There are various options …
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2005 Advanced Packaging Awards
… the development required for new device combinations. Amkor Technology, Chandler, Ariz., www.amkor.com. DIE ATTACH EQUIPMENT & MATERIALS HANDLING EQUIPMENT / FIXTURES Die Feeder Click here to enlarge image The DDf Ultra feeds a wide range …
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Advanced Packaging Awards 2006
… transfer. The system requires no complex plating. SUSS MicroTec, Inc. , Waterbury Center, VT, www.suss.com Die Attach Equipment & Materials DirEKt Coat consists of a micron-class mass-imaging system, ultra-flat pallet, die-attach …
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Advanced Packaging Awards Entry Showcase
… connections between stacked devices. Surface Technology Systems plc, Newport, Wales, www.stssystems.com. DIE ATTACH EQUIPMENT & MATERIALS Die Bonder Click here to enlarge image The 2200 evo handles up to 25 300-mm wafers on less than 1 …
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The APAs: Honoring Industry Innovation
… source to be placed remotely to minimize heating effects. Ultratech , San Jose, CA, www.ultratech.com. DIE - ATTACH EQUIPMENT & MATERIALS Inline Die-bonder Platform The AD8912 inline die-bonder consists of three major modules: the …
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Advanced Packaging Awards 2008: Signs of Hope
… recognition system, and post-bond inspection. Datacon Technology GmbH, Radfeld, Austria www.datacon.at Die - attach Equipment and Materials Click here to enlarge image Automatic Multi-chip Modules Bonder The latest generation large …
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2007 Finalist Showcase
… combination of silicon image sensor and LED light source. Ultratech , San Jose, CA, www.ultratech.com. DIE - ATTACH EQUIPMENT & MATERIALS Inline Die-bonder Platform The AD8912 inline die bonder consists of three major modules: the CPS12 …
