Dicing Die
Dicing Die news and technical articles from Solid State Technology Magazine. Search Dicing Die latest and archived news and articles
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Semicon West Product Preview
… suited to MEMS and wafer level packaging (WLP). Plasma Etch, Inc. Carson City, NV www.plasmaetch.com #7562 Dicing Die -attach Films Designed to streamline die-attach for stacked die applications, Hysol QMI5100 and Hysol QMI5200 combine …
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NEW PRODUCTS
… disco.co.jp. Die-attach Films Henkel’s Hysol QMI 5100 DDF and Hysol QMI 5200 DDF are pressure-sensitive dicing die -attach films on expandable polyolefin film that combine two functionalities into one product. They can be used for …
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Packaging/Assembly: Copper: Emerging material for wire bond assembly
… surface treatments, OP 2 , are required to protect the copper from oxidation during the assembly process, including dicing , die attach, thermal cure, and wire bonding. Click here to enlarge image Figure 3. a) Relative stiffness and b) strength …
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Wafer-level Microbumping for Flip Chips
… on pad: full microbumping (left), and localized microbumping (right). Click here to enlarge image After wafer dicing , die flip chip bonding was performed using pick-and-place equipment***. Assembly and interconnection were achieved …
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ASE licenses K&S technology to produce advanced copper wafer BGA packages
… wafer dicing. The tool removes native oxides from the copper wafer and protects it from further oxide growth during the dicing , die attach, curing, and wire bonding steps of semiconductor assembly interconnect. This patent-pending process is designed …
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Pursuing excellence
… Celebrating product excellence in semiconductor packaging, there are 12 categories in which companies may enter: wafer dicing , die placement and attach, wire bonding, encapsulation/molding, interconnection, lead forming, solder bumping, test …
