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  1. Hitachi Chemical claims die bonding film patent violation

    Article

    Thu, 19 Jan 2012

    designs. Hitachi Chemical offers die bonding film, dicing die bonding film and related products, and claims the largest ..... pending applications) related to die bonding films and dicing die bonding films in Japan and other countries. Contact

  2. Copper wire bonding offered from Quik-Pak

    Article

    Fri, 16 Dec 2011

    assembly services. Packaging can be provided as part of a turnkey assembly solution along with backgrinding, wafer dicing , die /wire bonding, laser micromachining, remolding and marking/branding. Plastic and ceramic packages, flip chips

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