Device Wafer
Device Wafer news and technical articles from Solid State Technology Magazine. Search Device Wafer latest and archived news and articles
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Device /wafer processing
Device / wafer processing
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Temporary bonding/debonding for ultrathin substrates
… enables temporary bonding of a device wafer to a rigid carrier substrate ..... and ultrathin wafers. Once the device wafer is temporarily bonded to the carrier ..... back-side processing steps, the device wafer can be easily released from the …
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Lithography and wafer bonding solutions for 3D integration
… stacking. Prior to thinning , the device wafer is mounted on a carrier wafer with ..... Lithography on the backside of the thin device wafer requires alignment of the photo ..... is bonded immediately to another device wafer for wafer-to-wafer stacking …
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2013: Thriving in the transition to 450mm
… technical risks due their scanning and step and repeat processes. We have added a new inspection technology targeted at device , wafer stress and pattern overlay, which will quickly identify yield and device performance issues. To provide our customers …
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Laser debonding enables advanced thin wafer processing
… designed in such way to have an easy and reliable debond, where the carrier wafer can be just lifted off the thinned device wafer . There are two basic approaches for implementing excimer laser-based debonding, namely, line scanning and step …
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SEMICON West 2012 exhibits preview: Semiconductor packaging products
… The system temporarily bonds a device wafer to a rigid carrier wafer for safe and efficient processing of the device wafer . After subsequent processing ..... via processing, etc.), the device wafer is debonded from the carrier substrate …
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3D integration with TSV: temporary bonding and debonding
… enables temporary bonding of a device wafer to a rigid carrier substrate and ..... first involves fully processing the device wafer on the front side. Subsequently, the carrier wafer and/or the device wafer is coated with an adhesive. Both …
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EV Group sells first ZoneBOND tech for compound semi work
… and existing adhesive platforms. Debonding can take place at room temperature with virtually no vertical force on the device wafer . ZoneBOND defines two carrier wafer zones, with strong perimeter adhesion and minimal center adhesion. This allows …
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Dual-beam laser spike annealing for advanced logic applications
… uniformity for a nickel silicide device wafer , calculated from measured reflectance ..... pattern density variations on the device wafer can cause large within-die ..... effects, we took an advanced logic device wafer pulled from the line at the second …
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Process Equipment for Next-generation WLP Technologies
… costs. High precision alignment of device wafer to cap wafer allows real chip ..... backside thinning process. The device wafer is bonded to a carrier wafer with ..... adhesives allow the release of the device wafer using different approaches. UV …
