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Deposited On The Wafer

Deposited On The Wafer news and technical articles from Solid State Technology Magazine. Search Deposited On The Wafer latest and archived news and articles

  1. Metallization processes for standardized wide-IO memory applications

    Article

    Sun, 1 Jan 2012

    hole is then filled with a copper plating solution. A CMP step is typically performed to remove the overburden deposited on the wafer flat by the previous steps. TSVs for wide IO standard applications are mainly of the via-last type. For such

  2. Undiluted slurry data improves CMP metrics

    Print

    Tue, 12 Jul 2011

    particular fab's slurry delivery system to calculate the quantified shear-stress induced on slurry before it is deposited on the wafer is just one factor. Deciding on how to emulate and simulate the degree of shear-stress on new slurry during

  1. CMP metrics improved by undiluted slurry data

    Article

    Thu, 2 Jun 2011

    particular fab's slurry delivery system to calculate the quantified shear-stress induced on slurry before it is deposited on the wafer is just one factor. Deciding on how to emulate and simulate the degree of shear-stress on new slurry during

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