Deep Reactive Ion Etching
Deep Reactive Ion Etching news and technical articles from Solid State Technology Magazine. Search Deep Reactive Ion Etching latest and archived news and articles
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MIT designs completely 3D MEMS
… Fachin says, fabricating 3-D devices in silicon is tricky. MEMS engineers use a common technique called deep reactive ion etching to make partially 3-D structures, in which two-dimensional elements are etched into a wafer. The technique …
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Tronics and Alcatel partner on advanced MEMS DRIE
… SA , manufacturer of custom MEMS components, and Alcatel Micro Machining Systems (AMMS), manufacturer of deep reactive ion etching (DRIE) systems for MEMS and 3D semiconductors, have announced a joint development project on DRIE for extreme …
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MEMS developments in China
… Semiconductors, Vol. 16, No. 2, p. 149-152, 1995. 6. E. H. Klaassen et al., "Silicon Fusion Bonding and Deep Reactive Ion Etching : A New Technology for Microstructure," Transducers, 95, p. 556-559, Stockholm, Sweden, June 25-29 …
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Vertical through-wafer insulation: Enabling integration and innovation
… isolated areas of the silicon. By taking advantage of the high aspect ratio and vertical sidewall capabilities of deep reactive ion etching (DRIE), trenches can be formed in silicon which extend all the way through the silicon wafer (FIGURE 1 …
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Si-Ware platform creates MOEMS on-wafer with lithographic alignment
… Multiple optical MEMS (MOEMS) structures can be patterned and etched on silicon on insulator (SOI) wafers using deep reactive ion etching (DRIE) . The structures are then wafer-level packaged and diced to create a one-chip optical system. SiMOST …
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DRIE expands from MEMS to advanced packaging and more applications
May 15, 2012 -- Deep reactive ion etching (DRIE) is a structuring process originally used to make micro electro mechanical systems (MEMS) . This process enables achieving …
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Tegal forms solar PV utility development company se2quel Partners
… manufacturing techniques, such as 3D interconnect structures formed by intricate silicon etch, also known as Deep Reactive Ion Etching (DRIE). Please visit www.Tegal.com . Subscribe to Photovoltaics World Follow Photovoltaics World on Twitter …
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Tegal-expands-ProNova-ICP-silicon-DRIE-reactor-family
… member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s deep reactive ion etching (DRIE) series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC …
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Asian semiconductor packaging specialist orders SPTS etch, PVD and CVD technologies for TSV
… etch systems are a suite of single-wafer etch process modules designed for various applications. The Omega Deep Reactive Ion Etching (DRIE) process modules provide production-worthy process capability, with high throughputs and tilt control …
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Tegal-expands-ProNova-ICP-silicon-DRIE-reactor-family
… member of its ProNova family of high-density inductively coupled plasma (ICP) reactors for the company’s deep reactive ion etching (DRIE) series wafer processing products. The ProNova2 is targeted for fast-growing 200mm MEMS and 3D IC …
