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Copper Wire

Copper Wire news and technical articles from Solid State Technology Magazine. Search Copper Wire latest and archived news and articles

  1. Improved copper wire bonding with non-contact metrology

    Article

    Thu, 1 Mar 2012

    Surfaces Division, Tucson, AZ, Copper wire is fast gaining popularity for ..... packaging semiconductor industry. Copper wire is fast gaining popularity for ..... is better to store and bond the copper wire under a nitrogen atmosphere since

  2. Copper wire bonding offered from Quik-Pak

    Article

    Fri, 16 Dec 2011

    Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa ..... production volumes. The trend toward copper wire bonding is driven by higher gold ..... protective reducing gas atmosphere, copper wire has excellent ball neck strength

  1. MX's RDL, copper wire bonding processes take aim at packaging costs

    Article

    Mon, 12 Dec 2011

    process that is fully compatible with copper wire bonding , reducing packaging costs ..... example), the company developed a copper wire bonding process that avoids dielectric ..... by higher mechanical stresses. Copper wire bonding will save materials costs

  2. Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

    Article

    Wed, 16 May 2012

    Pacific Technology offers new innovations in transport, copper - wire bonding, and automatic rethreading. The new wire bonder ..... technology enables it to operate faster with lower-cost copper wire rather than with gold wire, maintaining accuracy

  3. Analyst: Gold price surge helping Cu wire shipments

    Article

    Mon, 8 Aug 2011

    efforts to transition from gold to copper wire for fine-wire applications ..... packages that shipped worldwide with copper wire in 2010, and estimate those numbers ..... specifically QFPs) were implemented in copper wire first, with PBGAs starting later

  4. Carsem expands MLP/QFN capacity in Suzhou

    Article

    Tue, 24 May 2011

    million per day, with a focus on copper wire bonding . Construction commenced ..... packaging houses are moving to copper wire bonds for increasingly complex ..... competitive and state-of-the-art copper wire bonding technology and STATS ChipPAC

  5. Invensas debuts high-I/O PoP semiconductor packaging design

    Article

    Tue, 22 May 2012

    offers package performance for mobile electronics in the established package-on-package (PoP) architecture with copper wire bonds for stack interconnects. PoP designs package die and stack packages, instead of stacking die within a package

  6. memsstar appoints CEO with semiconductor and packaging experience

    Article

    Tue, 8 May 2012

    operational consultancy role in Europe’s high technology sector. He was CTO of Replisaurus Technologies, which develops copper wire bonding for IC packaging, from 2008 to 2011. Before that, he served as deputy CTO and VP of STMicroelectronics

  7. Glass-coated bonding wire targets copper, small diameter market

    Article

    Tue, 27 Mar 2012

    subsidiary of RED Equipment , announced a new high-quality copper wire featuring glass insulation for use in semiconductor wire ..... players. The technology will be used initially with copper wire , but will also be used with other types of metal cores

  8. Tanaka establishes copper bonding wire production in Taiwan

    Article

    Tue, 31 Jan 2012

    scale production due to accelerated copper wire adoption. The 4th location also ..... impacts by natural disasters. Copper wire demand from semiconductor manufacturers ..... estimates Tanaka Precious Metals. Copper wire is a lower-cost alternative to

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