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Copper Wire

Copper Wire news and technical articles from Solid State Technology Magazine. Search Copper Wire latest and archived news and articles

  1. Copper wire bonding offered from Quik-Pak

    Online Articles

    Fri, 16 Dec 2011

    Delphon Industries, is performing copper wire bonding on a Kulicke & Soffa ..... production volumes. The trend toward copper wire bonding is driven by higher gold ..... protective reducing gas atmosphere, copper wire has excellent ball neck strength

  2. STATS ChipPAC invests in copper wire bonding for 45nm, low-k

    Online Articles

    Wed, 4 May 2011

    million semiconductor packages with copper wire -bond interconnects. The SATS ..... equipment and resources to support copper wire technology in wafer nodes down ..... challenges in the application of copper wire . The transition from gold to copper

  1. MX's RDL, copper wire bonding processes take aim at packaging costs

    Online Articles

    Mon, 12 Dec 2011

    process that is fully compatible with copper wire bonding , reducing packaging costs ..... example), the company developed a copper wire bonding process that avoids dielectric ..... by higher mechanical stresses. Copper wire bonding will save materials costs

  2. Copper -wire -bonding-consortium-Freescale-GLOBALFOUNDRIES-UNISEM-and-more

    Online Articles

    Tue, 9 Nov 2010

    STAR) in Singapore, launched the Copper Wire (Cu-Wire) Bonding Consortium ..... UNISEM and Atotech S.E.A. Copper wire bonding has emerged as an important ..... a reliable bonding process for copper wire , including bond pad structures

  3. Kulicke-Soffa-pushes-copper -wire -bonding-transition with IConnPS ProCu

    Online Articles

    Tue, 9 Nov 2010

    ProCu wire bonder optimized for copper wire bonding. The K&S IConnPS ProCu ..... lines transitioning from gold to copper wire bonding . This is the latest addition ..... most advanced system available for copper wire bonding. Specialized copper processes

  4. IME to address copper interconnects reliability issues at Copper Wire Consortium

    Online Articles

    Mon, 25 Mar 2013

    semiconductor devices by tackling copper wire bonding issues related to corrosion ..... To understand the effects of copper wire hardness when bonding on different ..... modeling and characterization of copper wire bonding stress using stress sensors

  5. STATS ChipPAC ships 1 billionth package using copper wire bonds

    Online Articles

    Mon, 18 Jun 2012

    engineering expertise to developing a copper wire bonding process to suit advanced ..... packaging. STATS ChipPAC’s copper wire packaging roadmap serves a diverse ..... more customers are switching to copper wire interconnects from gold, said

  6. Oncor deters copper wire theft with nanotechnology

    Online Articles

    Fri, 3 Aug 2007

    and help law enforcement personnel find and prosecute thieves. The technology marks Oncor equipment and particularly copper wire so that it can be identified after it has been stolen. Oncor says it will work closely with law enforcement in this

  7. Flip Chip Interconnection Using Copper Wire Bumps

    Magazine Articles

    Wed, 1 Mar 2006

    Various flip chip systems have been used for advanced packages, including chip scale packages (CSPs) and ball grid arrays (BGAs).

  8. Copper wire pilot production, low-k feasability studied

    Magazine Articles

    Sun, 1 Feb 1998

    Copper wire in pilot production, low-k feasibility studied At the recent IEEE Electron Device Meeting (IEDM), held in Washington, DC

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