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ULSI devices with on-chip copper interconnects . However, the shrinking ..... scale factor. As a result, copper interconnects will suffer rapid increases ..... high-aspect ratio (HAR) copper interconnects . This article describes
Processing and integration of copper interconnects Robert L. Jackson, Eliot ..... conversion from aluminum to copper interconnects introduces many new processes ..... transition from aluminum to copper interconnects in semiconductor manufacturing
Electroplating bath control for copper interconnects Thomas Taylor, Thomas Ritzdorf, Fred Lindberg ..... are the de facto standard for the formation of copper interconnects . Damascene Cu will likely be introduced using
The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR) in Singapore, has launched the Copper (Cu) Wire Bonding Consortium II. The consortium which rides on the successes of Phase I launched in 2010 aims to improve the reliability of
Novellus authors investigated the film characteristics and process integration of TaN produced using iALD. High-density TaN with low resistivity and excellent conformality is demonstrated. With the adoption of Cu metallization, metal barriers such as TaN are needed to enhance the adhesion of metal
Demand for wafer fab equipment strengthened in the first half of 2004, causing Gartner Inc.'s Dataquest unit to increase its 2004 sales forecast for the tool segment to $27.36 billion from $16.74 billion in 2003 in its mid-year forecast released on July 8.
By James A. Cunningham, Consultant, Saratoga, California Early failures at the vias are severely limiting current density rules in today's copper dual-damascene interconnect system. Recent work shows that if the barrier at the base of the vias were removed or made substantially thinner, or if ...
IBM`s ASIC technologyuses copper interconnects IBM Corp., East Fishkill, NY, said it has successfully harnessed a copper metallization process, and has put the technology
As-electroplated copper undergoes a gradual recrystallization at room temperature related to the plating chemistry. The influence of damascene topography on the recrystallization as well as on the texture of Cu must be understood to optimize properties for superior interconnect performance. A ...
EXECUTIVE OVERVIEW Although copper interconnects have become essential to the ..... Even so, the limitations of copper interconnects are becoming clear. In a few ..... maximum current density for copper interconnects , thereby restricting the