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Components

Components news and technical articles from Solid State Technology Magazine. Search Components latest and archived news and articles

  1. Sealing components need standards!

    Article

    Tue, 1 Nov 2011

    borne to be chemically resistant first, and to be sealing components , second; they indeed mostly adhere to basic chemical requirements ..... rates of failure are associated WITH these types of sealing components . Today on 300mm tools, with process nodes attempting to

  2. Universal solar PV junction box released by Cyntech Components

    Article

    Thu, 29 Sep 2011

    Electro-mechanical component supplier Cyntech Components now offers a Yamaichi universal junction box ..... rated at 1000 V DC to TÜV EN50521. Cyntech Components supplies electromechanical components and sub-assemblies from various manufacturers

  1. Chip Supply changing its name to Micross Components , consolidating several facilities in Orlando

    Article

    Wed, 25 May 2011

    is changing its name to Micross Components , which reflects the acquisition ..... Supply last November by Micross Components in Los Angeles, CA. Micross provides ..... Inc., doing business as Micross Components , and eventually will drop the

  2. Mereco silver adhesive suits chip and leadframe bonding in heat-sensitive components

    Article

    Wed, 4 Apr 2012

    and exhibits 80D Shore hardness. Typical applications include manufacturing, assembly, and repair of heat-sensitive components . METADUCT 1202 is supplied in plastic bubble packs from 2 to 200 grams, five kits from 2 to 32 oz., and pre-mixed and

  3. Suniva adds BOS components to PV offering

    Article

    Wed, 12 Oct 2011

    around Suniva's high-efficiency monocrystalline modules, powered by ARTisun series solar cells. Pre-integration of BOS components helps reduce installation costs and ensure maximum power-conversion efficiency and reliability. The companies will have

  4. DARPA looks to Aurrion for E-PHI program to mix electronic, photonic, and MEMS components on one silicon chip

    Article

    Wed, 16 Nov 2011

    silicon substrate could help produce compact optical oscillators faster electronic feedback, enhanced coupling among photonic components , and better thermal and vibration tolerance than in technologies available today. In the E-PHI program, Aurrion experts

  5. Balancing cost/efficiency with solar BOS components

    Video

    Thu, 20 Oct 2011

    Debra fogler senior technical editor affordable to its world magazine reporting from solar power international 2011 in Dallas Texas. My guest is Andrew of Schneider electric welcome to the show Andrew thank you. Well I'd I'd simply my question is this you are actually Paper on. Power electronics is

  6. Temporary bonding material enables flexible active components , photovoltaics

    Article

    Fri, 2 Dec 2011

    Henkel Corporation, FlexTech Alliance, and the Flexible Display Center at Arizona State University completed a multi-phase project developing debondable laminating adhesives to enable active matrix backplane fabrication on flexible substrates.

  7. Plug-and-play solar power system relies on high-efficiency panel, integrated BOS components

    Article

    Mon, 14 Nov 2011

    ONYX has received several prototypes of its Plug-and-Play solar power system. The product uses a newly sourced 280W high-efficiency solar panel, micro-inverter, and high-capacity battery designed into the solar panel.

  8. Lower DRAM prices enable more DRAM per smartphone without higher pricetag

    Article

    Fri, 18 May 2012

    Dynamic random access memory (DRAM) components ' percentage of the cost of a smartphone ..... average selling prices (ASPs) for DRAM components caused DRAM costs in smartphones to fall ..... from PC-oriented designs to mobility components . With the available DRAM supply bolstered

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