Cob
Cob news and technical articles from Solid State Technology Magazine. Search Cob latest and archived news and articles
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LED manufacturers need dedicated toolset and cost savings
… analyzed in detail including emerging technologies like silicon substrates, wafer level packaging (WLP), chip on board ( COB ), etc. Companies mentioned in the report: 3M, A-Bright, ACC Silicon, Accretech, ADT Dicing, Advanced Photoelectronic …
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IC packaging report covers 12 package types + bare die, SATS providers
… level package (WLP). Additional unit forecasts cover die-mounting using direct chip attach (DCA) methods: Chip on board ( COB ); Flip chip on board (FCOB); Chip on glass (COG); Flip chip on glass (FCOG); And tape automated bonding (TAB …
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Engineered to the task: why camera-phone cameras are different
… decreasing cost and size is the wafer-level camera. Traditionally, camera modules are manufactured using chip-on-board ( COB ) assembly. In this approach, the image sensor die is attached to a substrate and interconnected by wire bonds. An enclosure …
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DEK-VectorGuard-3D-stencils-for-chip-on-board
… requirement. VectorGuard 3D meets the challenges of providing coverage for dedicated areas on the board, such as chip on board ( COB ). Equally, the process can be used to protect bonding areas from contact with the stencil. Other applications particularly …
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Advanced packaging technologies: Imbedding components for increased reliability
… actives and passives into package designs, such as multichip modules (MCM), system-in-package (SiP), chip-on-board ( COB ), and emerging system-level designs such as imbedded components. 2 In a paper presented at SMTA’s Pan Pacific Conference …
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Package or surface mount assembly?
… wafer level chip scale packages (CSPs)? And chip on board ( COB ) or direct chip attach (DCA) circuit card assemblies? Then ..... SMT than semiconductor packaging. Flipping to the other side, COB and DCA applications (e.g., early Motorola Star-Tac cellular …
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Advanced magnetic recording media for high-density data storage
… multilayer media created from alternating layers of 4Å magnetic CoB layer and 7Å nonmagnetic Pd layers repeated 12 times. The structure ..... recorded tracks at 1000, 5000, and 10,000 bits/mm into a CoB /Pd multilayer grown onto a 400nm Ni 45 Fe 55 soft magnetic …
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S M T Magazine Presents Packaging Panel at IPC Midwest
… sectors are looking to improve speed and performance through miniaturization. Wafer-level packaging (WLP) and chip on board ( COB ) attachment are helping this trend. Interestingly, Solberg notes, the layout of WLPs are standard pitches to PCB assembly …
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Embedded DRAM makes inroads into SoC devices
… Click here to enlarge image As we said earlier, this part incorporates stack DRAM, featuring capacitor-over-bitline ( COB ) construction, but unusually with a metal-insulator-metal (MIM) capacitor using a zirconium oxide high- k dielectric …
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New Products
… pitch wire-bonding applications in one platform. Applications such as radio frequency (RF), microwave, chip-on-board ( COB ), multichip module (MCM), hybrid, and fiber optics can be bonded using aluminum or gold wire at rates of up to 6 wires …
