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Cleaning And Surface Prep

Cleaning And Surface Prep news and technical articles from Solid State Technology Magazine. Search Cleaning And Surface Prep latest and archived news and articles

  1. FSI wins wafer clean tooling orders from FEOL and BEOL customers

    Article

    Tue, 7 Jun 2011

    FSI International Inc. (Nasdaq:FSII), surface conditioning equipment supplier, won orders for multiple ORION single wafer cleaning systems. A memory maker will use the ORION in wet photoresist strip and etch and a foundry will use it for backend-of-line (BEOL) processes, like cleaning film stacks.

  2. Suss joins imec's EUV mask integrity work

    Article

    Tue, 12 Jul 2011

    Suss Microtec and imec are expanding a research collaboration in mask cleaning to develop an in-fab approach to EUV lithography mask integrity, aiming to develop a sophisticated approach to preserving mask integrity prior to exposure.

  1. World News

    Print

    Mon, 11 Jul 2011

    BUSINESS TRENDS VLSI tool champs prove customer service matters VLSI Research's out with its annual "Best supplier" rankings, and there's a tie atop the leaderboard. Nine-time champ Varian Semi. Equip. Assoc. and first-timer Novellus both scored 8.18 in the "large supplier" category of chipmaking

  2. Adhesive improves solar silicon ingot sawing, dissolves in H20

    Article

    Wed, 17 Aug 2011

    Henkel Corporation introduced Loctite 3382, a water-debondable epoxy adhesive that bonds silicon and glass/metal mounting substrates during silicon ingot slicing operations, protecting against wafer breakage.

  3. Avantor, SACHEM selective etch chemisty doubles as wafer cleaner

    Article

    Wed, 6 Jul 2011

    Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.

  4. Undiluted slurry data improves CMP metrics

    Print

    Tue, 12 Jul 2011

    Executive Overview Leading IC manufacturers and semiconductor equipment companies are generating concerted efforts to improve the metrics, standards and quality control parameters for CMP slurry. Following more than 10 years of proprietary slurry recipe formulations, along with a dilution-sampling

  5. Singulus upgrades wet-chemical etch/clean to IPA-free

    Article

    Wed, 3 Aug 2011

    SINGULUS TECHNOLOGIES modified its SILEX wet-chemical batch silicon cleaning and etch system, introducing an Isopropanol (IPA)-free texturing process for mono-crystalline silicon solar cell fab.

  6. RBCN upgrages to larger sapphire wafer furnaces company-wide

    Article

    Thu, 18 Aug 2011

    Rubicon Technology (RBCN) completed company-wide enhancements to its proprietary crystal growth furnaces, upgrading to Rubicon Furnace Version ES2-XLG3.0, which produces large-diameter sapphire material with greater automation and higher yields.

  7. CMP metrics improved by undiluted slurry data

    Article

    Thu, 2 Jun 2011

    120hrs. (SlurryScope data of undiluted extended run measurements of slurry LPC). SOURCE: Vantage Technology" vspace="1" align="left" width="118" height="54" src="/etc/medialib/new-lib/solid-state-technology/online-articles/2011/6.Par.41267.Image.118.54.1.gif" />The requirement for CMP slurry to ...

  8. Update from Japan: TEPCO's nuclear recovery roadmap, semiconductor materials shortage concerns

    Article

    Mon, 18 Apr 2011

    Longtime semiconductor exec Takeshi Hattori continues his reporting on the aftermath of the massive Japanese earthquake and tsunami: Updates on efforts to control the nuclear crisis, efforts to shift to "summertime" schedules to manage energy usage, and evidence of shortages in key materials for ...

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