Chip Stacking
Chip Stacking news and technical articles from Solid State Technology Magazine. Search Chip Stacking latest and archived news and articles
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A Novel ACA for 3D Chip Stacking and Lead-free PCB Packaging
… players and heterogeneously integrated RF systems, chip stacking using a system in package (SiP) approach is becoming ..... concepts such as reverse pyramid stacking and nested chip stacking . The Purdue research has also demonstrated that chip …
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Cover Story: Bare Chip Stacking
… conductivity in the stack. Most chip stacking solutions require additional processing ..... solutions include: Back-to-back chip stacking . This involves placing a wire ..... Preparation Critical to the success of chip stacking is the protection of the active …
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IBM tips TSV 3D chip stacking technique
April 13, 2007 - IBM says it has developed a way to incorporate through-silicon vias (TSV) into its chipmaking process that shortens data-travel distances by up to 1000x and allows for 100x more pathways than 2D chips. Samples of 65nm chips using the 3D stacking technique will be shipped by year's
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STATS ChipPAC and UMC unveil 3D IC developed under open ecosystem
… Microelectronics Corp. (NYSE: UMC; TWSE: 2303) announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration. The 3D chip stack, consisting of a wide I/O memory …
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TI achieves volume production with stacked clip-bonded QFN
… TI, NYSE:TXN) has shipped more than 30 million units of its PowerStack packaging technology, a combination of chip stacking and clip bonding that is designed to improve performance and chip densities in power management devices. In PowerStack …
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Robotic die bonder upgrades SET packaging platform
… San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to- chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes. The FC300R uses a loading robot …
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Elpida, PTI, UMC finalize 3D IC partnership
… incorporating logic+DRAM interface design, through-silicon via (TSV) formation, wafer thinning, testing, and chip stacking assembly. The joint development work at Elpida's plant in Hiroshima, Japan, which targets advanced processes including …
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Consortium to develop cost-effective 3D interconnects
… to address technical and cost issues of creating of thru-silicon-via (TSV) 3D chip interconnect, for use in chip stacking and MEMS/sensor packaging. The Semiconductor 3D Equipment and Materials Consortium (EMC-3D) will develop processes …
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Consortium to focus on cost-effective 3D thru-silicon-via interconnects
… address the technical and cost issues of creating 3D interconnects using Thru-Silicon-Via (TSV) technology for chip stacking and MEMS/sensors packaging. Several major equipment manufactures have joined with material companies to work with …
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Technology News
… gearmakers choosing SiP over SoC While fab folks are still mostly only talking about design for manufacturing and 3D chip stacking , the assembly world is actually doing it, and getting significant improvements in system-in-a-package (SiP …
