Chip Stacking
Chip Stacking news and technical articles from Solid State Technology Magazine. Search Chip Stacking latest and archived news and articles
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TI achieves volume production with stacked clip-bonded QFN
… TI, NYSE:TXN) has shipped more than 30 million units of its PowerStack packaging technology, a combination of chip stacking and clip bonding that is designed to improve performance and chip densities in power management devices. In PowerStack …
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Robotic die bonder upgrades SET packaging platform
… San Francisco, CA. The FC300R performs chip-to-substrate bonding, chip-to-wafer assembly, and chip-to- chip stacking for flip chip, through silicon via (TSV), and other advanced packaging processes. The FC300R uses a loading robot …
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Elpida, PTI, UMC finalize 3D IC partnership
… incorporating logic+DRAM interface design, through-silicon via (TSV) formation, wafer thinning, testing, and chip stacking assembly. The joint development work at Elpida's plant in Hiroshima, Japan, which targets advanced processes including …
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AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab
… Kiang at the official opening ceremony of the Centre of Excellence in Advanced Packaging. The research will cover 3D chip stacking , such as through silicon via (TSV) formation, power use and form factor reductions, signal integrity, and more …
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ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more
… 10x that of present state-of-art inductors. By introducing an unprecedented combination of magnetic materials, chip - stacking design and a 2.5D chip packaging process, the team from Columbia University (funded in part by the SRC) demonstrated …
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Fan-in WLCSP outpaces semiconductor packaging market
… Développement after the completion of several projects linked to the characterization and modeling of high density TSV and 3DIC chip stacking in collaboration with CEA Leti and STMicroelectronics during his PhD. The Yole report includes technical and market …
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SEMICON West 2011: New product roundup
… hands-free placement capabilities for chip-to-substrate or chip-to-wafer assembly as well as chip-to- chip stacking , particularly suited for 3D IC applications using high-density through-silicon vias (TSV). It offers submicron …
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Smart systems research group tackles design methodology
… time-to-market, and integration risks. Advanced packaging technologies such as system-in-package (SiP) and chip stacking (3D IC) with through-silicon vias (TSV) already allow manufacturers to package heterogeneous parts -- digital …
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What's driving MEMS commercialization
… created. Another very interesting aspect of MEMS packaging is quickly emerging...that of wafer level packaging, chip stacking and TSV. Now many MEMS foundries are offering this capability with wafer "capping" being a mainstay of MEMS for …
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EV Group joins Ga. Tech's 3D packaging center
… 2006 to address the technical and cost issues of creating 3D interconnects using through-silicon vias (TSV) for chip stacking and MEMS/sensors packaging; that group, having met its goal of $150/wafer, will be ending this summer .
