Chip On Board
Chip On Board news and technical articles from Solid State Technology Magazine. Search Chip On Board latest and archived news and articles
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Cleanroom Requirement Debated for Chip -on -Board Assembly
… Cleanroom Requirement Debated for Chip - on - Board Assembly BY Shelia Galatowitsh Chip - on - board /direct-chip-attach (COB ..... any hybrid or MCM operation. " Chip - on - board is not quite an extension of …
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Wafer-level packaging boosts yields of chip -on -board image sensors
Chip - on - board (COB) is the most dominant assembly process used to build over a million camera modules each day of the year. These camera modules …
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Samsung introduces new, high efficacy chip on board LED packages
… it is introducing a new 129lm/W high efficiency, chip - on - board (COB) family of LED packages , LC013/26/40B ..... in 2700K, 3000K and 4000K versions. By adopting chip - on - board technology that utilizes metal core PCBs, the new …
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Silicon chip -on -board LED substrate enables best thermal dissipation
… light-emitting diode (LED) industry’s best thermal dissipation performance on its Glaxum LED Array family of chip on board (COB) modules. The proprietary Nano-Pore Silicon Substrate (NPSS) technology developed by Daewon Innost led to …
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DEK-VectorGuard-3D-stencils-for-chip -on -board
… requirement. VectorGuard 3D meets the challenges of providing coverage for dedicated areas on the board, such as chip on board (COB). Equally, the process can be used to protect bonding areas from contact with the stencil. Other applications …
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Large-area wedge bonder
… equipment. This allows efficient processing of the large panels and multi-up carriers used in the assembly of chip - on - board , chip-on-flex, and multichip module (MCM) devices. Throughput is >5 wires/sec and pad pitch capability …
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Vern Solberg: Design Miniaturization
Vern Solberg, STI – Madison, speaks on miniaturization, such as wafer-level packaging (WLP) and chip on board (COB).
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Upcoming SMTA events: IWLPC keynote named, SMTAI seeks presenters
… papers can cover 0.3mm Pitch Area Array, 3D Packaging and Integration, BGA/CSP, Biomedical Packaging, Bumping, Chip on Board , Direct Chip Attach, Embedded and Miniature Passives, Failure Analysis, Fine Lead Pitch, Flip Chip, High Temperature …
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LED manufacturers need dedicated toolset and cost savings
… Trends are analyzed in detail including emerging technologies like silicon substrates, wafer level packaging (WLP), chip on board (COB), etc. Companies mentioned in the report: 3M, A-Bright, ACC Silicon, Accretech, ADT Dicing, Advanced …
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Copper wire bonding offered from Quik-Pak
… bonding, laser micromachining, remolding and marking/branding. Plastic and ceramic packages, flip chips and chip - on - board designs, as well as stacked-die, rad-hard, and MEMS devices are in Quik-Pak's portfolio. Learn more at …
