Chip Mounting
Chip Mounting news and technical articles from Solid State Technology Magazine. Search Chip Mounting latest and archived news and articles
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Wire-bonding/AOI, chip mounting areas linked: Case study from IPTE
Continental Corporation applied economic conveyor and handling modules from IPTE’s EasyLine product portfolio to link its gold and aluminum wire bonding, mounting, and AOI areas.
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Sony opens R&D center for chip -mounting technology
Dec. 21, 2001 - Tokyo, Japan - Sony Corp. has opened a semiconductor-mounting technology R&D facility within its semiconductor assembly plant in Oita Prefecture.
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Fujitsu-transfers-flip-chip-to-China
… s Fujitsu Semiconductor Ltd. will transfer its flip chip mounting technology to a Chinese group affiliate for system chip assembly. Flip chip mounting attaches semiconductor chips directly to boards with …
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Packaging and Antennae Technology Improvements
Arthur Chait, EoPlex, discusses ceramic and metal parts fabrication using a new technology. We look at miniaturized antennae and semiconductor package LGA substrate products built with this formative manufacturing platform. LGA substrates can be prepared with pins for chip mounting and overmold to ...
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Elpida begins sampling 8Gb DDR3 SDRAM
… reducing parasitic resistance and capacitance. In addition, chip height is decreased and the DIMM socket is eliminated. Chip mounting area is reportedly reduced 70%. Exactly one year ago , Elpida Memory, Powertech Technology (PTI), and United …
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3D progress seen at SiP global summit
… reducing parasitic resistance and capacitance. In addition, chip height is decreased and the DIMM socket is eliminated. Chip mounting area is reportedly reduced 70%. A 16Gb module (consisting of two 4 chip stacks) occupies far less room (11mm …
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Achieving cost and performance goals using 3D semiconductor packaging
… interconnect both incased and uncased devices. It has become more common for companies to use smaller passives and flip- chip mounting to reduce module size. In addition, many commercial component outlines have significantly decreased in size and …
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World News
… readying a new wafer pattern inspection system for "green" devices. Fujitsu Semiconductor Ltd. will transfer its flip chip mounting technology to a Chinese group affiliate for system chip assembly. Sanyo Semiconductor reportedly plans a 40% ramp …
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Future implications of IC packaging for the PCB
… High-density flip chip mounted onto a µPILR configured substrate. A potential solution for high-density flip- chip mounting is a relatively new build-up substrate fabrication process that was developed to provide an array of uniform raised …
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Achieving cost and performance goals using 3D semiconductor packaging
… interconnect both incased and uncased devices. It has become more common for companies to use smaller passives and flip- chip mounting to reduce module size. In addition, many commercial component outlines have significantly decreased in size and …
