Chip Manufacturing news and technical articles from Solid State Technology Magazine. Search Chip Manufacturing latest and archived news and articles
Semiconductor chip manufacturing technology in general, and MEMS manufacturing technology in ..... diagnostics, medical devices, and instrumentation, and different chip manufacturing technologies must be applied differently for each segment. Clémence
IBM recently announced the first application of a breakthrough self-assembling nanotechnology to conventional chip manufacturing , borrowing a process from nature to build the next-generation computer chips. The natural pattern-creating
the world's largest semiconductor packaging and testing companies, announced today the availability of two new chip manufacturing technologies: Tape Carrier Package (TCP) and High Lead Bumping. "Over the past few years, as the demand for
assemblies, with a goal toward helping to define optimal flux cleaning process parameters for high-performance flip- chip manufacturing processes. In this study, model flip-chip components were assembled, cleaned, tested and evaluated. Side
(August 16, 2007) EL SEGUNDO, CA Apple Inc.'s iPhone release bumped up the company's influence on semiconductor design in the first half of 2007, analyst firm iSuppli Corp. reports. Its regional design influence tool (RDIT) shows Apple's design activity to have a significant impact on the global
executive deputy president Yutaka Nakagawa explained that the move is part of Sony's "asset light" strategy to end chip manufacturing investments after the 65nm node. The increased number of chips produced at 45nm would be offset by the fact that
IBM) May 4, 2007 -- IBM claims the first-ever application of self-assembling nanotechnology to conventional chip manufacturing . The company says it has harnessed the natural pattern-creating process that forms seashells, snowflakes, and
January 25, 2006 -- /PRNewswire-FirstCall/ -- FREMONT, Calif. -- Mattson Technology, Inc. today announced the shipment of its Aspen III eHighlands low-k/copper strip system to DongbuAnam Semiconductor, Korea's largest pure-play foundry.
AUSTIN, TX -- (MARKET WIRE) -- 04/21/2005 -- Drawing on acclaim for its first such event, the International SEMATECH Manufacturing Initiative (ISMI) will hold a second annual ISMI Symposium on Manufacturing Effectiveness October 24-26 at the Hilton Austin Airport.
Corporation ( NASDAQ:KLAC ) launched the eDR-7000 electron-beam (e-beam) wafer defect review system for chip manufacturing at the 20nm device nodes and below . New technologies enhance sensitivity and throughput during defect imaging and