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Chip Fab

Chip Fab news and technical articles from Solid State Technology Magazine. Search Chip Fab latest and archived news and articles

  1. North American chip fab tool makers report 4th month of orders growth in January

    Article

    Fri, 24 Feb 2012

    North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.

  2. North American chip fab tool book-to-bill up in November

    Article

    Fri, 16 Dec 2011

    North America-based manufacturers of semiconductor equipment posted $973.3 million in orders in November 2011, $1.17 billion in billings, and a book-to-bill ratio of 0.83, according to the November Book-to-Bill Report from SEMI.

  1. Chip fab tool book-to-bill holds steady for North American makers

    Article

    Fri, 18 Nov 2011

    "The recent period’s billings and bookings reflect the slowing capital investment in the industry that has been evident throughout the year,” said Denny McGuirk, SEMI. “While overall spending has declined, investments in NAND Flash, sub-30nm technology, and system LSI are on-going."

  2. Optogan LED chip fab opens in Germany

    Article

    Fri, 14 Oct 2011

    Optogan opened its LED production site in Landshut, Germany, planning to produce 1 billion chips/year initially.

  3. Micropelt opens thin-film thermoelectric chip fab in Germany

    Article

    Mon, 4 Jul 2011

    Micropelt opened its automated, high-volume Halle/Saale, Germany thermoelectric chip manufacturing facility, with customized clean room and production tech for thermoelectric thin films on 6" silicon wafers, processing them into micro coolers, sensors and thermogenerators.

  4. AMAT debuts full-vacuum gate stack tool for 22nm chip fab

    Article

    Tue, 12 Jul 2011

    Applied Materials (AMAT) launched the Applied Centura Integrated Gate Stack system for creating gate dielectric structures in 22nm logic chips. It processes the entire high- k multilayer stack in a single vacuum environment, preserving integrity of film interfaces.

  5. LEDs are fundamentally semiconductors, running up against fab and packaging issues, says Philips Lumileds

    Article

    Wed, 18 May 2011

    processes lack the level of automation seen in the semi chip fab industry. Wafer size transitions are occuring rapidly ..... thicknesses also vary. The forefront of LED fab, much like chip fab , is wafer level packaging (WLP), cluster tools for

  6. Lithography tool buying increases on logic and chip foundry demand

    Article

    Mon, 16 Apr 2012

    though the analysts see incremental shrink buying from DRAM players, and leave the NAND forecast largely intact. Memory chip fab is “clearly weak,” says Barclays analysts, but outside of Elpida/Rexchip, capex plans remain largely intact

  7. Semiconductor wafer fab equipment trends: Deposition

    Article

    Tue, 10 Apr 2012

    of total WFE spending) stayed fairly flat at 20.6%. Chemical vapor deposition (CVD) tools saw a decline in chip fab spending, dropping from 62% in 2010 to 58% in 2011. Meanwhile, electrochemical deposition (ECD) and physical vapor

  8. Semiconductor makers ready for H2 2012 snapback

    Article

    Mon, 27 Feb 2012

    per our estimate, as the cyclical rebound accelerates and forward sales seasonally ramp. Also read: North American chip fab tool makers report 4th month of orders growth Q4 2011 inventory dollars fell dramatically at handset OEMs (–13% QOQ

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