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"The recent period’s billings and bookings reflect the slowing capital investment in the industry that has been evident throughout the year,” said Denny McGuirk, SEMI. “While overall spending has declined, investments in NAND Flash, sub-30nm technology, and system LSI are on-going."
North America-based manufacturers of semiconductor equipment posted $973.3 million in orders in November 2011, $1.17 billion in billings, and a book-to-bill ratio of 0.83, according to the November Book-to-Bill Report from SEMI.
North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.
Optogan opened its LED production site in Landshut, Germany, planning to produce 1 billion chips/year initially.
Micropelt opened its automated, high-volume Halle/Saale, Germany thermoelectric chip manufacturing facility, with customized clean room and production tech for thermoelectric thin films on 6" silicon wafers, processing them into micro coolers, sensors and thermogenerators.
Applied Materials (AMAT) launched the Applied Centura Integrated Gate Stack system for creating gate dielectric structures in 22nm logic chips. It processes the entire high- k multilayer stack in a single vacuum environment, preserving integrity of film interfaces.
Joachim Burghartz, IMS CHIPS, presented an improved version of the group's Chipfilm technology introduced at IEDM 4 years ago. The researchers now have a manufacturable process technology.
GigOptix (GGOX) named Innovative Micro Technology (IMT) as its optical chip fabrication partner. GGOX is now in the process of transferring production of its Thin Film Polymer on Silicon (TFPS) optical modulator chips to IMT in expectation of volume production ramping in 2011.
October 26, 2006 - Automation and control technology firm Omron Corp. has agreed to acquire a 200mm CMOS semiconductor factory in Yasu, Shiga, Japan from Yasu Semiconductor Corp., a consolidated subsidiary of Seiko Epson. Terms of the deal were not disclosed.
December 7, 2007 - Fab construction firm M+W Zander says it has received a $400M contract to design and build an advanced semiconductor fab in China, for an undisclosed customer -- but signs point to one big chipmaker in particular.