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Chip Assembly news and technical articles from Solid State Technology Magazine. Search Chip Assembly latest and archived news and articles

  1. Kyocera doubles flip-chip assembly with new cleanroom in US

    Online Articles

    Tue, 7 Feb 2012

    2012 -- Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 ..... Qualified Manufacturer's List (QML)-certified flip- chip assembly provider. The cleanroom can fabricate fine-pitch

  2. Multi Flip Chip Assembly for the Mass Market

    Online Articles

    Mon, 21 Jul 2008

    high-end applications, flip chip assembly technology is rapidly finding ..... end production steps, flip- chip assembly , system-in-package (SiP ..... solution approaches for multiple- chip assembly : Placement machine takes over

  1. AMD puts Suzhou chip assembly plant into trial operation

    Online Articles

    Fri, 3 Dec 2004

    December 3, 2004 - California-based chip maker Advanced Micro Devices (AMD) has put its chip assembly plant in Suzhou into trial operation. The plant is going to assemble and test chips starting from next year, which means that

  2. Rebuffed Carlyle eyes stake in Japan chip assembly firm

    Online Articles

    Wed, 18 Apr 2007

    price haggling, US private equity firm Carlyle Group is taking a 15% stake in Nakaya Microdevices Corp., a Japanese chip assembly and test house, according to local newspaper reports. Carlyle reportedly will invest 1.5 billion yen (US $12

  3. RFID Chip Assembly for 0.1 Cent?

    Magazine Articles

    Tue, 1 Nov 2005

    that will drive down the production cost. Chip Assembly at 0.1¢ Per Bond Analysts predict that by 2007, there will be low cost chip assembly solutions available to drive down chip - assembly cost to 0.1¢ per bond. Applied to a

  4. Challenges in Flip Chip Assembly

    Magazine Articles

    Tue, 1 May 2007

    challenges of 21 st century flip chip assembly . Amkor: Finer Bump Pitch As ..... fine-pitch high-I/O flip chip assembly . 3 BOL bonds the bumped die directly ..... Gold-to-gold thermosonic flip chip assembly is a flux-free, low-stress approach

  5. Pulsed-laser Heating for Flip Chip Assembly

    Magazine Articles

    Mon, 1 May 2006

    stress introduced during flip chip assembly is a significant concern in the ..... Some materials used in the flip chip assembly process, such as anisotropic ..... materials currently used in flip chip assembly . This is especially true for

  6. Variable Flip Chip Assembly for High-volume Production

    Magazine Articles

    Tue, 1 Jun 2004

    performance and cost all favor flip chip assembly , which is expected to grow at ..... of 27 percent per year. Flip Chip Assembly Solder bump and adhesive flip ..... Mid-range and low-end flip chip assembly are, therefore, competitively

  7. Adhesive Interconnect Flip Chip Assembly

    Magazine Articles

    Tue, 1 Mar 2005

    adhesive over solder bump flip chip assembly clearly foretell a wider role for adhesive flip chip assembly in tomorrow’s demanding products ..... flux-free, lead-free, flip chip assembly . However, beyond those obvious

  8. Matsushita to build new chip assembly plant in China

    Online Articles

    Fri, 15 Jul 2005

    July 15, 2005 - Matsushita Electric Industrial Co. said Thursday it has started construction of a new semiconductor assembly plant in China to meet surging demand, said Jiji Press.

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