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The Orion III PECVD system produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
A vacuum loadlocked PECVD system that produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels.
A chemical vapor deposition (CVD) polymer technology has been developed to use low cost monomers and provide highly crystalline and thermally stable polymer
reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products is "a critical part of our ..... reactive ion etch (DRIE) and plasma-enhanced chemical vapor deposition (PECVD) products and related IP in a $5M in
two new orders for its Model 650 hot filament chemical vapor deposition (HFCVD) diamond reactor, including one from ..... on a wide variety of substrate materials. The chemical vapor deposition technology is ideal for applications such as
Corp. , has shipped its first EasyTube 6000 chemical vapor deposition system. The multi-tube EasyTube 6000 horizontal ..... is offered with atmospheric and low- pressure chemical vapor deposition processes. In Q4 2007, First Nano plans to
Chemical vapor deposition (CVD) has become an essential technique for thin film deposition ..... F211-F218, 2003. V.Y. Vassiliev, S.M. Repinsky, “ Chemical Vapor Deposition of Thin Film Dielectrics,” Russian Chemical Reviews, 74(5), pp. 413
Texas overview Metal etch and low pressure chemical vapor deposition processes are placing additional demands on established ..... Click here to enlarge image In many etching and chemical vapor deposition (CVD) wafer fabrication processes, the desired
Vapor delivery system The GS-437 for chemical vapor deposition , diffusion processes and etch operations supplies a precise flow of chemical vapor without the use of a carrier gas by controlling
BOC Gases, Murray Hill, New Jersey Chlorine trifluoride (ClF3) is a highly reactive process gas used in chemical vapor deposition (CVD) and diffusion furnace applications for nonplasma cleans. Relatively new to US wafer manufacturers