Ceramic
Ceramic news and technical articles from Solid State Technology Magazine. Search Ceramic latest and archived news and articles
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Novellus replaces TiN hard masks with ceramic for sub-22nm nodes
… Novellus Systems (NASDAQ:NVLS) debuted ceramic hard mask (CHM) materials for use in ..... production line. Etch byproducts from ceramic hard materials are volatile, and are therefore ..... Manufacturability is also improved, since the ceramic hard mask materials do not require the …
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CTS contracted for 2 piezo-ceramic programs
CTS Electronic Components, of CTS Corporation (NYSE:CTS), received 2 production orders for piezoceramic products from a major US sonar manufacturer. Revenues should total about $5 million.
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HB-LED grade aluminum nitride meets thermal needs of today's LEDs
… aluminum nitride (AlN) and what it accomplishes as a ceramic substrate for high-brightness light emitting ..... cost substrates. HB-LED devices are bonded to a ceramic tile, comprising a ceramic substrate metallized with thick-plated copper …
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K&S capillary specifically suits LED wire bonding
… light-emitting diode (LED) die wire bonding . The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability. The LUMOS is designed for LED packaging specifically, targeting better bond quality and …
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DuPont LTCC material suits 50GHz+ electronics
… GreenTape 9K5 low temperature co-fired ceramic (LTCC) packaging material, offering ..... be presented on October 12, during the Ceramic and LTCC Packaging I Session (WA3) of ..... Wave Frequency Range," as part of the Ceramic and LTCC Packaging II Session (WP3 …
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NXP assembles RF power transistors in plastic packages
… plastic packages are a lower-cost option alongside NXP's ceramic package RF devices. The overmolded plastic package can reduce bill of materials (BOM) costs by 20% (compared to ceramic ), said Mark Murphy, director of RF power products, NXP …
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Honeycomb heatsink cools BGAs in thin-profile devices
… while producing a steady flow of cool air inside the heatsink. Honeycomb heatsinks can be used with either plastic or metal/ ceramic BGA packages, depending on the thermal interface material (TIM). The design is studded with holes, helping increase surface …
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APNT's new thermal interface materials meet power semiconductors' reqs
… printed materials for power electronics and photonics packaging . The first 2 products are polymer-based (DTC-P) and ceramic -based (DTC-C). THERCOBOND materials are designed for power electronic device packaging and dielectric coating, balancing …
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Low cost AlN substrate technology for HBLED and power semiconductors
… alternatives. HBLED devices are bonded to a ceramic "tile" that consists of a ceramic substrate that has been metallized with thick ..... device occurs through both the Cu vias and the ceramic . The ceramic material provides electrical isolation …
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Handling the 450mm Wafer with Structural Ceramics
… with material limitation. Fabrication of ceramic end-effectors and wafer chucks become ..... availability of 96.0% and 99.5% ceramic sheet material permits the fabrication ..... required by the machine manufacture. Large ceramic sheets In the 1960s, semiconductors were …
