Capillary Underfill
Capillary Underfill news and technical articles from Solid State Technology Magazine. Search Capillary Underfill latest and archived news and articles
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Improving package-on-package reliability: a multi-material approach
… reflowed and then underfilled as per traditional methods, the top-level package presents a dilemma as traditional, capillary underfill processes simply aren't conducive to the level two package assembly. Historically, the top package has been …
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Flip chip PoP is perfect for mobile, if done right
… high-throughput underfill. Consequently, the industry is pursuing advanced encapsulation techniques such as capillary underfill , no-flow underfill, vacuum underfill and mold underfill, in addition to continually refining the rheology …
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3D ICs in the spotlight at IMAPS
… product development expenses to make sense. He discussed two new Dow products: a new low viscosity, high-speed capillary underfill (CUF) which uses <3μm filler and a new aqueous developable low- k dielectric ( k = 2.85). Regarding 3D IC …
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Henkel releases NCP for copper pillar interconnect
… to 200µm. The tighter pitches of Cu Pillar interconnect technology are not highly compatible with traditional capillary underfill processes, as flow time can be a drain on throughput and UPH and complete coverage is uncertain at best. Hysol …
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Underfill Technology
… Material flows underneath the package and gaps between the CSP and substrate are encapsulated. Figure 1. Capillary underfill is applied to device edges. Click here to enlarge image While the use of capillary underfills have significant …
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Epoxy Flux Technology
… free solder joint formation and, when cured, delivers protection against mechanical stress. Unlike traditional capillary underfill processes, this material enables an in-line alternative that affords thorough device protection as well.
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Analyst: 2H09 recovery for DRAM…maybe
… photodielectric materials for IBM’s 3D packaging technologies, and also develop new materials for wafer–level and capillary underfill applications. EV Group and Brewer Science have established an ultrathin wafer bonding lab in Taiwan to offer localized …
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VOTE! Participate in the Sixth Annual Attendee's Choice Awards
… joint formation and, when cured, delivers underfill-like protection against mechanical stress. In conventional capillary underfill processes, once the device is mounted onto the printed circuit board (PCB) or other substrate, the assembly …
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Flip Chip’s Midlife Crisis
… silicon. Process control during fluxing and chip attachment is more critical than with eutectic lead-tin bumps. Capillary underfill flow is also slower, because of the smaller chip-to-substrate gap, but standard equipment and cleaning are …
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Flip Chip Cleaning with Vapor Phase Solvents
… Solvent Concentration is Essential Driver for Cleaning BY MIKE BIXENMAN AND KYLE DOYEL On flip chip assemblies using capillary underfill , flux residue remaining after reflow must be removed to allow the uniform flow of underfill and to ensure a strong …
