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  1. K&S capillary specifically suits LED wire bonding

    Article

    Fri, 9 Mar 2012

    NASDAQ:KLIC) launched the LUMOS Capillary for light-emitting diode (LED) die wire bonding . The capillary can bond with gold or gold-alloy wires ..... over a longer bonding time. The LUMOS Capillary will debut at the Semicon China show

  2. Halogen-free underfill uncrated at Henkel

    Article

    Wed, 2 Nov 2011

    materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high glass transition temperature (T g ). The material is designed for chipscale packages (CSP) and ball

  1. Stiction free removal of organic sacrificial layers in MEMS manufacturing

    Article

    Tue, 1 May 2012

    the substrate, yielding an attractive capillary force. During the release process ..... illustrate an elastic microstructure under a capillary pull: In Equation 1, κ is the spring ..... force, whereas the denominator is the capillary force. When the elastic force is greater

  2. KLIC wire bonder debuts for low-pin-count, discrete packaging

    Article

    Fri, 9 Mar 2012

    China show at the Shanghai New International Expo Centre from March 20-22, 2012. Also debuting at K&S' booth: LUMOS Capillary for LED wire bonding and new AccuPlus Hub Blades for discrete semiconductor dicing . Kulicke & Soffa (NASDAQ: KLIC) designs

  3. Kulicke & Soffa semiconductor wafer dicing blades tuned for discretes

    Article

    Fri, 9 Mar 2012

    China show at the Shanghai New International Expo Centre from March 20-22, 2012. Also debuting at K&S' booth: LUMOS Capillary for LED wire bonding and the ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging . Kulicke

  4. Imec, Lam Research improve wafer drying with test method

    Article

    Mon, 24 Oct 2011

    microscopy (TD-SEM) inspection. Shallow trench isolators, gate structures, and stacked capacitors can fall victim to capillary forces during the dry step of wet cleaning processes. Improved drying techniques will reduce the risk of stiction. Also

  5. MIT builds LED underwater

    Article

    Thu, 14 Jul 2011

    new substrate material options like flexible polymers and plastics. Researchers using a syringe to push solution through a capillary tube one-tenth of a millimeter wide. Capital-intensive semiconductor manufacturing processes and facilities were unneccessary

  6. CIS solar cell fab cluster plans demo line in 3 years

    Article

    Tue, 26 Jul 2011

    whose core competence is the development and industrial production of micro and nano-structured glass as high precision capillary optics for beam shaping of x-rays, as well as devices and components for x-ray analysis, especially process-oriented

  7. Carbon nanotubes green microextraction method

    Article

    Thu, 7 Apr 2011

    solvent methods is solid phase microextraction (SPME) in which some solid phase adsorbent (of micrograms) is placed on a capillary fiber of melted silica. This fiber is exposed to the sample and adsorbs it. Afterwards, desorption process takes place

  8. Reworkable edgebond adhesive improves CBGA and BGA thermal cycle performance

    Article

    Thu, 7 Apr 2011

    easier to process than an underfill. When applying underfill, the printed circuit board (PCB) is preheated to facilitate capillary flow, and multiple dispense passes are used to deposit sufficient material. With UA-2605, only four beads of the adhesive

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