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NASDAQ:KLIC) launched the LUMOS Capillary for light-emitting diode (LED) die wire bonding . The capillary can bond with gold or gold-alloy wires ..... over a longer bonding time. The LUMOS Capillary will debut at the Semicon China show
materials at Productronica, November 15-18 in Munich, Germany. The new HYSOL underfill is a halogen free, reworkable epoxy capillary underfill with a high glass transition temperature (T g ). The material is designed for chipscale packages (CSP) and ball
the substrate, yielding an attractive capillary force. During the release process ..... illustrate an elastic microstructure under a capillary pull: In Equation 1, κ is the spring ..... force, whereas the denominator is the capillary force. When the elastic force is greater
China show at the Shanghai New International Expo Centre from March 20-22, 2012. Also debuting at K&S' booth: LUMOS Capillary for LED wire bonding and new AccuPlus Hub Blades for discrete semiconductor dicing . Kulicke & Soffa (NASDAQ: KLIC) designs
China show at the Shanghai New International Expo Centre from March 20-22, 2012. Also debuting at K&S' booth: LUMOS Capillary for LED wire bonding and the ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging . Kulicke
microscopy (TD-SEM) inspection. Shallow trench isolators, gate structures, and stacked capacitors can fall victim to capillary forces during the dry step of wet cleaning processes. Improved drying techniques will reduce the risk of stiction. Also
new substrate material options like flexible polymers and plastics. Researchers using a syringe to push solution through a capillary tube one-tenth of a millimeter wide. Capital-intensive semiconductor manufacturing processes and facilities were unneccessary
whose core competence is the development and industrial production of micro and nano-structured glass as high precision capillary optics for beam shaping of x-rays, as well as devices and components for x-ray analysis, especially process-oriented
solvent methods is solid phase microextraction (SPME) in which some solid phase adsorbent (of micrograms) is placed on a capillary fiber of melted silica. This fiber is exposed to the sample and adsorbs it. Afterwards, desorption process takes place
easier to process than an underfill. When applying underfill, the printed circuit board (PCB) is preheated to facilitate capillary flow, and multiple dispense passes are used to deposit sufficient material. With UA-2605, only four beads of the adhesive