C4np
C4np news and technical articles from Solid State Technology Magazine. Search C4np latest and archived news and articles
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C4NP Process Update
… 2007, IBM announced the qualification of C4NP for 200µm pitch lead-free solder ..... IBM has qualified 150µm pitch C4NP lead-free bumped wafers on a fully populated ..... MicroTec is now completing build of additional C4NP equipment to meet ramping demand for lead …
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Cost, production, and logistics implications of C4NP solder bumping
… Collapse Chip Connection: New Process ( C4NP ), works with lead-free solder alloys ..... free continues for the entire industry. C4NP , a solder bumping technology developed ..... bumping using lead-free solder alloys. C4NP is a solder transfer technology by which …
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IBM, SUSS ramp C4NP pilot line
… collapse chip connection new process ( C4NP ) production line in East Fishkill, NY ..... completing initial reliability testing for 300mm C4NP solder-bumped wafers . The automated ..... bump and test for IBM, which is using C4NP packaging for its gaming systems products …
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Suss, IBM readying C4NP toolset
… testing with IBM for 300mm lead-free C4NP solder-bumped wafers, and is building ..... analysis, and Alpha emissions IBM ordered the C4NP ("controlled collapse chip connection ..... s facilities in East Fishkill, NY. C4NP offers an alternative method for applying …
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IBM-fine-pitch-substrate-bumping-skips-solder-paste-beyond-C4NP
… substrates (Figure 1). “Four years ago, IBM introduced C4NP (C4 new process) as a low cost and environmentally friendly ..... volume production at IBM," said Nah. IMS is a variation of C4NP for solder deposition on fine-pitch laminates. The manufacturing …
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SUSS Chooses ULCOAT for C4NP
… controlled collapse chip connection new process ( C4NP ) glass molds. The glass MEMS division of ..... molds needed to bump wafers using IBM's C4NP process. The molds would be incorporated into SUSS C4NP processing equipment. Glass mold performance …
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C4NP Test Data Released
Preliminary C4NP manufacturing and reliability test results of both tin-lead and lead ..... verify that there are no inherent failure mechanisms attributable to the C4NP process, according to a report presented by IBM and SUSS MicroTec at the …
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ULCOAT chosen as potential mold supplier for SUSS C4NP
… the first potential commercial source for C4NP glass molds has been selected. SUSS explained ..... molds needed to bump wafers using IBM's C4NP process. "The availability of a commercial ..... vice president and business manager for C4NP at SUSS MicroTec, in a prepared statement …
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IBM Ramps C4NP in NY Facility
… collapse chip connection new process ( C4NP ) production line in East Fishkill, ramping ..... fill, inspection, and transfer steps. " C4NP offers lower-cost bumping with improved ..... turning out products for gaming systems using C4NP packaging.
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Japan's ULVAC testing C4NP molds
… production of reusable glass molds used in C4NP (Controlled Collapse Chip Connection ..... Hughlett, VP and business manager for C4NP at Suss MicroTec, adding that the Japanese ..... exceeded our expectations from day one". C4NP places prepatterned solder balls onto the …
