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video from SEMICON West 2010, Marcus Wimplinger, EV Group, summarizes the results of SEMATECH work using EVG's 300mm bonding systems that enables submicron alignment. Highly accruate wafer bonding is used for Cu-to-Cu bonding and other packaging applications
Munich, Germany — Freescale Semiconductor recently ordered one of SUSS MicroTec's ABC200 automated production wafer- bonding systems . Silicon wafer bonding is a critical wafer-level packaging technology and an enabling technology for the mass production of cost-effective MEMS accelerometers for ...
SEMICON West, SUSS MicroTec launched the ELAN CBC300SOI, its new 300mm SOI wafer bonding system , and said that it has already shipped the SOI bonding system to a leading manufacturer of SOI wafers. At the core of the cluster tool is SUSS
Infotonics gains MEMS fabrication and packaging flexibility with new SUSS bonding systems
manufacturing and test equipment for the semiconductor and emerging markets, announced an order for its ELAN CB6L wafer bonding system to NanoWorld Services . NanoWorld Services, located in Erlangen, Germany, is a developer, manufacturer, and supplier
SUSS MicroTec , has launched its new 300mm SOI wafer bonding system , ELAN CBC300SOI. The new release represents the most recent ..... SUSS says it has already shipped its new 300mm SOI wafer bonding system to a leading manufacturer of silicon-on-insulator
surface energy values. Aligned wafer- bonding systems . Aligned silicon wafer bonding is ..... In anodic bonding applications, the bonding system may apply voltages up to 2kV, or for ..... infrared imaging. This integrated bonding system is being used for the production of
Foundry to use wafers for 3D IC and advanced packaging volume production applications.
Hi vulgar of solid technology magazine reporting from semi west my guess is Marcus on TV who will come. Morning all right well my question to you is this I know that he beat them has already announced results of work with some attack on 3-D IC wafer to wafer. Copper recovered from a compression
bond interface. EVG also released the 850SOI/450mm wafer bonding system for 450mm SOI wafers -- company exec Paul Lindner discusses ..... higher. Ablestik SSP2000 can be processed on standard die bonding systems . Henkel says that the Ablestik SSP2000 can bring throughput