Bond Interface
Bond Interface news and technical articles from Solid State Technology Magazine. Search Bond Interface latest and archived news and articles
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Integration and 3D-ICs driving developments in wafer bonding
… applications, the standardized bond interface is based on a planarized oxide ..... on most wafers. The resulting bond interface does not imply any limitations ..... shows the process steps toward a bond interface required for fusion wafer bonding …
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Tezzaron licenses Ziptronix's bonding tech for 3D memory
… licensing deals outside the image sensor space were in the pipeline. "With our DBI, which contains interconnect at the bond interface , Tezzaron can provide a technologically superior product in the memory market at a lower cost and better performance …
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Novati to use Ziptronix bonding tech for 3D assembly
… 3D designs with true, 3D integration and TSV interconnect." "With our DBI, which contains interconnect at the bond interface , Novati can now provide technologically advanced services in many different markets at a lower cost and better performance …
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Lithography and wafer bonding solutions for 3D integration
… the alignment keys buried in the bond interface . After backside processing ..... wafer with its frontside in the bond interface . After bonding the first step ..... side, which is buried in the bond interface . Modern mask aligners have integrated …
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Interfacial properties of Cu-Cu direct bonds for TSV integration
… grinding was achieved. The original bond interface tended to disappear with increasing ..... can help Cu diffuse through the bond interface even when bonding is done at a ..... energy increases and the original bond interface tends to disappear. The post …
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Interfacial properties of Cu-Cu direct bonds for TSV integration
… grinding was achieved. The original bond interface tended to disappear with increasing ..... can help Cu diffuse through the bond interface even when bonding is done at a ..... energy increases and the original bond interface tends to disappear. The post …
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Olympus inspects bonded wafers with IR microscopy
… confocal capability of the microscope to take XZ measurements at various points on the wafer provides information on the bond interface thickness uniformity. Using the system's IR microscope imaging capability, bonded wafers are automatically scanned …
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SEMICON West 2011: New product roundup
… carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of the bonded stack; and voids in the bond interface . EVG also released the 850SOI/450mm wafer bonding system for 450mm SOI wafers -- company exec Paul Lindner discusses …
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Thin-wafer bond/debond metrology from EVG opens process control, supply chain possibilities
… carrier wafer, adhesive layer, bonded stack and thinned wafer; bow/warp of the bonded stack; and voids in the bond interface during wafer bonding/de-bonding. In-line process control for thin-wafer processing enables IC manufacturers …
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EVG tool bonds 450mm SOI semiconductor wafers
… contact with the wafers. "The bonding step acts like a magnifying glass for particles, so anything trapped at the bond interface is a problem and needs to be eliminated," explained Linder. "So in the tool, particle control is the biggest …
