Bond Interface
Bond Interface news and technical articles from Solid State Technology Magazine. Search Bond Interface latest and archived news and articles
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Integration and 3D-ICs driving developments in wafer bonding
… applications, the standardized bond interface is based on a planarized oxide ..... on most wafers. The resulting bond interface does not imply any limitations ..... shows the process steps toward a bond interface required for fusion wafer bonding …
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Olympus inspects bonded wafers with IR microscopy
… confocal capability of the microscope to take XZ measurements at various points on the wafer provides information on the bond interface thickness uniformity. Using the system's IR microscope imaging capability, bonded wafers are automatically scanned …
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SEMICON West 2011: New product roundup
… carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of the bonded stack; and voids in the bond interface . EVG also released the 850SOI/450mm wafer bonding system for 450mm SOI wafers -- company exec Paul Lindner discusses …
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Thin-wafer bond/debond metrology from EVG opens process control, supply chain possibilities
… carrier wafer, adhesive layer, bonded stack and thinned wafer; bow/warp of the bonded stack; and voids in the bond interface during wafer bonding/de-bonding. In-line process control for thin-wafer processing enables IC manufacturers …
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EVG tool bonds 450mm SOI semiconductor wafers
… contact with the wafers. "The bonding step acts like a magnifying glass for particles, so anything trapped at the bond interface is a problem and needs to be eliminated," explained Linder. "So in the tool, particle control is the biggest …
