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Kulicke & Soffa (NASDAQ: KLIC) makes semiconductor and light-emitting diode (LED) assembly equipment, offering ball bonding and die and wedge bonding tools. Learn more at www.kns.com . Visit the Advanced Packaging Channel of Solid State
Another advantage of copper is that it is much less susceptible to forming intermetallic compounds (IMCs) during ball bonding to the aluminum pads. In a "good" bond, ideally over 50% of the ball's footprint should feature formation of
Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper. Quik-Pak's copper ball bonding can be done with 20μm (0.8 mil) to 30μm (1.2 mils) -diameter wires, at prototype and pre-production volumes