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Ball Bonding news and technical articles from Solid State Technology Magazine. Search Ball Bonding latest and archived news and articles

  1. Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

    Article

    Wed, 16 May 2012

    Kulicke & Soffa (NASDAQ: KLIC) makes semiconductor and light-emitting diode (LED) assembly equipment, offering ball bonding and die and wedge bonding tools. Learn more at www.kns.com . Visit the Advanced Packaging Channel of Solid State

  2. Improved copper wire bonding with non-contact metrology

    Article

    Thu, 1 Mar 2012

    Another advantage of copper is that it is much less susceptible to forming intermetallic compounds (IMCs) during ball bonding to the aluminum pads. In a "good" bond, ideally over 50% of the ball's footprint should feature formation of

  1. Copper wire bonding offered from Quik-Pak

    Article

    Fri, 16 Dec 2011

    Maxum Ultra wire bonder. Available wires include bare copper and palladium-coated copper. Quik-Pak's copper ball bonding can be done with 20μm (0.8 mil) to 30μm (1.2 mils) -diameter wires, at prototype and pre-production volumes

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