Back-End Equipment
Back-End Equipment news and technical articles from Solid State Technology Magazine. Search Back-End Equipment latest and archived news and articles
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Advances in Metal Deposition for Wafer Bumping
… developments in the front-end have created a need for new packaging solutions, placing increased pressure on back - end equipment manufacturers. Processing and handling of ultra-thin wafers in back-end packaging tools are a result of device …
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IN THE NEWS
… and repair. Pac Tech USA, Hesse & Knipps, Inc., for instance, exhibited at the show, but these types of back - end equipment suppliers were in short supply. Mike Foster, of Samsung exhibited at SMTAI. Click here to enlarge image Gail Flower …
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In the News
… suppliers to survive, and the possibility exists for companies like Applied Materials and KLA-Tencor to expand into back - end equipment . He stressed the importance of consortia between device and equipment manufacturers and advised the packaging …
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In The News
… infrastructure there,” says Thorsten Teutsch, president of Pac Tech USA. Nagase expects sales of Pac Tech’s back - end equipment and materials in China and Japan to double over the next 3 years, according to Kazuo Nagashima, Nagase’s …
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SEMICON West 2008 in Review
… was hard to tell the difference between the front-end and back-end players. It wasn’t so long ago that the back - end equipment and materials manufacturers had their own show in San Jose, while the front-end portion happened in San Francisco …
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2007: Packaging Saves the World
… design collaboration. Helmut Rutterschmidt, Datacon Technology GmbH In our estimate, the general markets for back - end equipment will weaken next year compared to 2006. Yet, we expect to achieve significant growth. Our position in the volume …
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Nagase Acquires 60% Share of Pac Tech
… market. Pac Tech's strong presence in Japan and China should enable Pac Tech to double their overall sales of back - end equipment and materials over the next 3 years from approximately 6 billion JPY in 2005, claims Kazuo Nagashima, Nagase …
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Rudolph buys Applied Precision's semiconductor biz
… not initially disclosed. For Rudolph, the deal "accelerate[s] our efforts to be a more complete supplier of back - end equipment and software," said chairman/CEO Paul McLaughlin, in a statement, noting that this deal is yet another sign …
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RFID Chip Assembly for 0.1 Cent?
… a fully functional, passive RFID transponder - and whether it could be on the market by 2008, the suppliers of back - end equipment are aggressively pursuing various technology avenues to decrease manufacturing costs for ubiquitous RFID tags. Smart …
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Analysts say 2007 worldwide semi capital equipment spending will increase 4 percent
… positive for capital expenditure (capex) and wafer fab equipment (WFE) to slightly negative. The outlook for back - end equipment markets remains positive. WFE revenue is forecast to grow 6.4 percent in 2007. The 45-nm technology node …
