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return to the low 90% range by the second half of 2012, providing for a positive capital investment environment. Back - end equipment markets (which include wafer-level packaging and assembly equipment, die-level packaging and assembly equipment
efficiency. With Wafra's funding commitment, BSE Group will grow its portfolio of semiconductor front-end and back - end equipment for lease. The BSE Group provides short term, long term, systems, options, subsystems and spares level rentals
K. will provide operating leases to semiconductor companies in both front-end fabrication tools as well as back - end equipment used for test and assembly. The subsidiary comes at a time of "profound change in the Japanese manufacturing