Home>Topics>Back-End Equipment

Back-End Equipment

Back-End Equipment news and technical articles from Solid State Technology Magazine. Search Back-End Equipment latest and archived news and articles

  1. Semiconductor capex to fall 11.6% in 2012, says Gartner

    Article

    Wed, 21 Mar 2012

    return to the low 90% range by the second half of 2012, providing for a positive capital investment environment. Back - end equipment markets (which include wafer-level packaging and assembly equipment, die-level packaging and assembly equipment

  2. BSE Group achieves milestones in semiconductor equipment financing biz

    Article

    Thu, 26 Jan 2012

    efficiency. With Wafra's funding commitment, BSE Group will grow its portfolio of semiconductor front-end and back - end equipment for lease. The BSE Group provides short term, long term, systems, options, subsystems and spares level rentals

  1. Boston Semi Equipment brings fab equipment leasing to Japan

    Article

    Fri, 11 Nov 2011

    K. will provide operating leases to semiconductor companies in both front-end fabrication tools as well as back - end equipment used for test and assembly. The subsidiary comes at a time of "profound change in the Japanese manufacturing

© 2012. PennWell Corporation. All Rights Reserved. PRIVACY POLICY | TERMS AND CONDITIONS