Automated Inspection news and technical articles from Solid State Technology Magazine. Search Automated Inspection latest and archived news and articles
York, to develop standards and best practices for automated inspection for the next generation 3DIC and TSV processes ..... there are many well-established technologies for automated inspection of the front-side of the wafer, inspecting the
a supplier of inspection solutions to the microelectronics industry, today introduced a complete solution for automated inspection of 300mm wafers designed to meet the unique and challenging needs of 300mm processing. The tool is built on the
(July 8, 2005) Minneapolis, Minn. — August Technology Corp. has installed its 500th NSX Series automated defect inspection system. First introduced in 1997, the NSX Series detects defects greater than 0.5 µm, and also performs advanced macro inspection.
(December 11, 2006) MIGDAL HA'EMEK, Israel Camtek Ltd. introduced the Pegasus 200S automated optical inspection (AOI) system to evaluate finished high-density interconnect substrates (HDI-S). The model is expected to automate traditionally manual quality-assurance inspection, said Yankee Yavor,
Automated inspection system Model 890 automatically inspects wafers and die, and performs package substrate bump inspection. Featuring a very high
Automated inspection of OPC and PSM masks Wolfgang Staud, Karen Huang, Patricia Beard, Photronics Inc., Milpitas, CaliforniaYair Eran, Applied
NASDAQ: KLAC) debuted an automated inspection system for substrates and ..... manual inspection vs. automated inspection ). SOURCE: KLA-Tencor ..... Burkeen also explained how automated inspection results in higher defect
KLA-Tencor has debuted an automated inspection system for substrates and ..... manual inspection vs. automated inspection . (Source: KLA-Tencor ..... Burkeen also explained how automated inspection results in higher defect
could not be detected by automated inspection systems - known generically ..... process are performed on automated inspection systems and the remainder ..... becomes increasingly critical. Automated inspection . Decreasing dimensions of
Suited to inspection of MEMS devices, the AW200 Series C-SAM acoustic micro imaging system from Sonoscan performs automated inspection , analysis and sorting of bonded wafers up to 200-mm in diameter. To avoid immersing the bonded wafer pair in