Analytical Equipment
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Olympus inspects bonded wafers with IR microscopy
Greg Baker, Olympus Integrated Technologies America, discusses why the company chose to focus its efforts on IR metrology for defect inspection of bonded wafers. Olympus-ITA launched the latest 3DIR Metrology and Defect Review System at SEMICON West 2011, booth 1524.
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TESCAN combines nano-analysis tools in one platform
TESCAN introduced the LYRA GM focused ion beam and scanning electron microscope (FIB--SEM) workstation, calling the system a multifunctional tool for nanotechnology.
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Graphene creates flexible film to rival ITO
Rice University researchers combined single-layer graphene with a fine aluminum nanowire mesh to create a transparent, flexible, conductive material to rival the more expensive indium tin oxide (ITO) in LEDs, displays, and solar cells.
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Gold wires go brittle at nanoscale
Gold wires are used in electronic devices due to the material's flexiblity and conductive quality. At the nanoscale, however, gold wires (
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XsunX confirms 16.3% top efficiency for CIGS solar cells
XsunX, hybrid thin-film photovoltaic solar cell manufacturing process developer, had its copper-indium-gallium-(di)selenide (CIGS) photovoltaics technology certified at 16.3% top efficiency by the NREL.
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CNT supercapacitors enable harsh-environment energy storage
Rice University researchers created a solid-state, CNT-based supercapacitors, combining aspects of high-energy batteries and fast-charging capacitors with harsh-environment ruggedness.
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Peptides, electrodes work together on bio-circuit at U Penn
University of Pennsylvania researchers formed biological molecules connected to electrodes, paving the way for direct biological integration into electronic circuits. The team also developed a new microscope technique to measure the electrical properties of these constructs.
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NEMS sensor improves AFM
The US National Institute of Standards and Technology's (NIST) Center for Nanoscale Science and Technology (CNST) has improved atomic force microscopy (AFM) by replacing the microscope's optical instrumentation with a nanomechanical cantilever probe and nanophotonic interferometer on a chip.
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Scan diagnostic analysis assists SoC fab debug/process monitoring
Steve Palosh, Freescale Semiconductor, Austin, TX USA; Geir Eide Mentor Graphics Corp., Wilsonville, OR USA
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NEMS/MEMS built by heated AFM, nanolithography patterning at Georgia Tech
Georgia Tech researchers and international collaborators have developed a thermochemical nanolithography process, using a heated AFM tip to fabricate ferroelectric structures on flexible, plastic substrates. New NEMS and MEMS can be constructed on more fragile substrate materials.
