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Nitride (TEGaN). The diamond packaging boosts GaN power handling capability by at least 3x, Raytheon reports. Advanced transistors and monolithic microwave integrated circuits (MMICs) can use TEGaN to reduce thermal resistance, multiplying GaN
But thermal budgets are getting tougher as technologies scale: chipmakers use RTP/anneal at multiple steps in advanced transistors : source/drain, silicide, interlayer dielectric and high- k densification, and now with new FinFET architectures