3d Transistor
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Mentor Graphics User Conference 2013 to feature former TSMC CTO
… Friends of Children with Special Needs. He was formerly the Chief Technology Officer of TSMC. He is known for developing the 3D transistor , FinFET, that can be scaled to sub-10nm. He also developed IC reliability models and the industry-standard SPICE model …
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UMC licenses IBM’s 20nm, FinFET semiconductor technology
… NYSE:UMC; TWSE:2303) has licensed IBM technology to expedite the development of its 20nm CMOS process with FinFET 3D transistors . Under the terms of the agreement, IBM will license its 20nm process design kit and FinFET technology to UMC so the foundry …
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Process Watch: Taming the overlay beast
… output of the overlay metrology tool. Examples of particularly challenging classes of materials are those used to build 3D transistors , and hard mask materials used during litho-etch-litho-etch lithography. Hard mask materials are opaque to visible …
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European consortia, ASML, supplier network plan for 450mm transition
… tools and public R&D funding sources, European consortia can be expected to link important process development efforts in 3D transistors , 3DIC, and other areas with 450mm production requirements. Many of the current EEMI450 programs also feature unique approaches …
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Supply chain readiness in an era of accelerated change
… These costs will be incurred concurrently with other major technical challenges in the industry, including the move to 3D transistor structures, and EUV and 3D stacked chips already mentioned. The recent investments in ASML by Intel and TSMC reflect just …
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NIST tips "hybrid" metrology method to test chips
… factor of three in some cases, NIST claims. This approach, the scientists say, will be a key part of measuring complex 3D transistor structures that are quickly approaching the 16nm node and beyond. In fact, Silver reveals that "IBM and GlobalFoundries …
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3M, IBM to make 3D chip adhesives
… brick" could make chips 1000 faster than today's fastest microprocessor. Today's chips, even those touted as " 3D " transistors , are really just flat-structure 2D chips, claims IBM's Bernie Meyerson, VP of research. These new materials, though …
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Intel’s Q1 2012 earnings: Key takeaways
… sustainable advantages in manufacturing, its product roadmaps, process leadership, technology leadership (high- k , 3D transistors ), and scale. However, tablets and smartphones are tempering growth in Intel's core business, with some WoA risks …
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FEI plasma FIB tool suits MEMS, 3D packaging
… nano-amps, according to the company. Because of its speed, FEI will target new technologies, such as 3D packaging and 3D transistor design technologies, where PFIB analysis is more practical. High-volume milling/high beam current Ga-FIB loses size …
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The era of fully-depleted devices
… choice of CMOS architecture: continue with the evolutionary scaling path through adoption of the planar FDSOI, or introduce 3D transistors , known as FinFET or TriGate. Either choice comes with challenges of its own. This review will discuss the tradeoffs and …
