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research program to fully exploit the potential of novel 3D technologies . Besides 3D interconnection technologies developments ..... and 3D stacked IC (3D SIC), based on foundry-level 3D technology additions. Depending on the application and the systems
integration. The first adopters of 3D technology were MEMS, followed by analog ICs ..... testament to the building momentum for 3D technology in high-speed, high-bandwidth ..... to be improved for broad adoption of 3D technologies . Paul Lindner is executive technology
Hi Deborah ball over here reporting from semi con west guest is mark an science welcome to the show it reaching. Well now my question for you is. Very simple to characterize the readiness of three technologies. Especially with the materials and. It's come a long way have been in the industry about
Mark Privett, Brewer Science, says that new technologies allow use of higher temperatures as well as room-temperature processes, such as wafer de-bonding. The 3D industry is nearly ready for high-volume, yet still without industry standards.
PoP provides a cost/performance solution that solves business and logistics issues associated with stacking devices directly. 3D TSV, with its associated uncertainties, cannot yet meet PoP's benefits, says TechSearch International (TSI).
Mechanical stresses can prevent successful implementation of 3D packaging technologies, says Larry Smith, SEMATECH. He argues for a DFM-like solution to identify and manage stress on thinned and stacked die in 3D ICs. To complicate matters, foundries, OSATs, and memory suppliers could inflict ...
collaborate to understand and develop solutions for the use of 3D technologies in future wireless products. Qualcomm represents fabless ..... Van den hove. IMEC's 3D integration program explores 3D technology and design for application in various domains, focusing
By Ritwik Chatterjee, Ph.D., and Rao R. Tummala, Ph.D, Packaging Research CenterGeorgia Institute of Technology There is a need for miniaturization at the IC, module, and system levels. There is stil research and development required to bring this hetero-integration technology to cost-effective ...
July 26, 2011 - Despite the evolving confusion with other " 3D " technologies , 3D IC integration has been making significant commercial strides in the last 12 months because many think it will ultimately
major announcements, from the system level to the layers of semiconductors. IMEC's major interests include scaling with 3D technologies , selective epitaxy, RRAM, lithography, and more. Hot spots create charge losses in stacked chips. Stacking is nice