3d Technologies
3d Technologies news and technical articles from Solid State Technology Magazine. Search 3d Technologies latest and archived news and articles
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IMEC extends 3D system integration program
… research program to fully exploit the potential of novel 3D technologies . Besides 3D interconnection technologies developments ..... and 3D stacked IC (3D SIC), based on foundry-level 3D technology additions. Depending on the application and the systems …
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3D integration key to 22nm semiconductor devices
… integration. The first adopters of 3D technology were MEMS, followed by analog ICs ..... testament to the building momentum for 3D technology in high-speed, high-bandwidth ..... to be improved for broad adoption of 3D technologies . Paul Lindner is executive technology …
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Readiness of 3D technologies from a materials perspective
Hi Deborah ball over here reporting from semi con west guest is mark an science welcome to the show it reaching. Well now my question for you is. Very simple to characterize the readiness of three technologies. Especially with the materials and. It's come a long way have been in the industry about
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Video: Readiness of 3D technologies from a materials perspective
Mark Privett, Brewer Science, says that new technologies allow use of higher temperatures as well as room-temperature processes, such as wafer de-bonding. The 3D industry is nearly ready for high-volume, yet still without industry standards.
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Will PoP delay TSV adoption? TechSearch International analyzes the 3D technologies
PoP provides a cost/performance solution that solves business and logistics issues associated with stacking devices directly. 3D TSV, with its associated uncertainties, cannot yet meet PoP's benefits, says TechSearch International (TSI).
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If wide I/O DRAM and other 3D technologies can go HVM standards are needed
Mechanical stresses can prevent successful implementation of 3D packaging technologies, says Larry Smith, SEMATECH. He argues for a DFM-like solution to identify and manage stress on thinned and stacked die in 3D ICs. To complicate matters, foundries, OSATs, and memory suppliers could inflict ...
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Electronics Industry Association News
… collaborate to understand and develop solutions for the use of 3D technologies in future wireless products. Qualcomm represents fabless ..... Van den hove. IMEC's 3D integration program explores 3D technology and design for application in various domains, focusing …
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3D Technology and Beyond: 3D All Silicon System Module
By Ritwik Chatterjee, Ph.D., and Rao R. Tummala, Ph.D, Packaging Research CenterGeorgia Institute of Technology There is a need for miniaturization at the IC, module, and system levels. There is stil research and development required to bring this hetero-integration technology to cost-effective ...
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3D IC with TSV show significant advances in last 12 months
July 26, 2011 - Despite the evolving confusion with other " 3D " technologies , 3D IC integration has been making significant commercial strides in the last 12 months because many think it will ultimately …
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IMEC discusses major projects at SEMICON West
… major announcements, from the system level to the layers of semiconductors. IMEC's major interests include scaling with 3D technologies , selective epitaxy, RRAM, lithography, and more. Hot spots create charge losses in stacked chips. Stacking is nice …