3d Technologies
3d Technologies news and technical articles from Solid State Technology Magazine. Search 3d Technologies latest and archived news and articles
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Will PoP delay TSV adoption? TechSearch International analyzes the 3D technologies
PoP provides a cost/performance solution that solves business and logistics issues associated with stacking devices directly. 3D TSV, with its associated uncertainties, cannot yet meet PoP's benefits, says TechSearch International (TSI).
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3D integration key to 22nm semiconductor devices
… integration. The first adopters of 3D technology were MEMS, followed by analog ICs ..... testament to the building momentum for 3D technology in high-speed, high-bandwidth ..... to be improved for broad adoption of 3D technologies . Paul Lindner is executive technology …
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Semiconductor packaging houses gain from more device complexity
… yield/cost requirements and form factor constraints (mobile) are coming to push increased use of flip chip , 2.5D and 3D technologies . This trend benefits the packaging subcontractors in the semiconductor industry, argues Credit Suisse Taiwan Analyst Randy …
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3D IC with TSV show significant advances in last 12 months
July 26, 2011 - Despite the evolving confusion with other " 3D " technologies , 3D IC integration has been making significant commercial strides in the last 12 months because many think it will ultimately …
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IMEC discusses major projects at SEMICON West
… major announcements, from the system level to the layers of semiconductors. IMEC's major interests include scaling with 3D technologies , selective epitaxy, RRAM, lithography, and more. Hot spots create charge losses in stacked chips. Stacking is nice …
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Suss MicroTec 3D IC workshop addresses thin wafer handling and testing
… 3D Integration: Are we there yet?" to hear technical experts from around the globe to present updates on the status of 3D technology . Eric Beyne of IMEC addressed the technical issues of carrier systems for 3D through-silicon via (TSV) thinning and backside …
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Invensas debuts high-I/O PoP semiconductor packaging design
… CA. Titled "Fine Pitch Copper PoP for Mobile Applications" the paper will be part of Session 31, "Applications With 3D Technology ," at 4:45 PM on Friday, June 1, 2012. Invensas will also exhibit at ECTC in booth 107 on May 30 and 31, 2012. Invensas …
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"3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu
… ready yet. The silicon interposer, Tong felt, would get us a major part of the way there, and could be ready sooner than 3D technology , thus the term 2.5D, which immediately caught on with other practitioners. Yu’s new position is that interposer technology …
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3D packaging enters the mainstream: Attend the conference
… attachment and underfilling with warpage control. Session 3: Modeling and Simulation Chair: Sai Ankireddi, Intersil 2.5D/ 3D technologies present unique challenges for the microelectronics packaging industry. In particular, there are multiple areas that need …
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CEA-Leti launches 3D semiconductor packaging platform
… their advanced semiconductor products and research projects. The Open 3D platform includes Leti’s "off-the-shelf" 3D technologies -- design and layout; technologies including interconnections, through silicon vias (TSV), and components assembly …
