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years, I believe that through-silicon via (TSV) for 3D stacking will increase in usage for multiple stacked chips, which ..... phones, and related devices. This change will make TSV 3D stacking a strategic weapon for many chip manufacturers. With
side integration that is inherent in SSIT, Ramalingam said the company believes that it is a much better approach than 3D stacking because the thermal issue is pretty much nonexistent in the sense that the power dissipation would be more like a monolithic
Léti and Brewer Science, Inc. signed a common lab agreement to combine their expertise in integration and materials into ultra-thin wafer processing flows for 3D packaging using Brewer Science's temporary adhesives. They are also collaborating in the development of photosensitive and ...
GLOBALFOUNDRIES announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, N.Y., the company
Semiconductor last fall , will use the technology for 3D stacking services and test. Tezzaron itself recently licensed ..... platform, full-line foundry in the world offering 3D stacking services and test to all its customers," stated Dave
GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 campus in Saratoga County, N.Y., the company
December 9, 2011 -- Honeywell Microelectronics will use Tezzaron's 3D stacking on Honeywell’s S150 process on radiation-hardened (rad-hard) aerospace electronics components. Honeywell will use Tezzaron
host sessions and courses with Amkor, Research in Motion, and TechLead Corporation on package-on-package (PoP) 3D stacking at SMTA International (SMTAI), October 16-20 in Fort Worth, TX. Lee Smith, Amkor Technology, will present
chips. Samples of chips using the 3D stacking technique will be shipped by year ..... fabricating a prototype SRAM design using 3D stacking technology and through-silicon ..... supercomputer chips. IBM says the 3D stacking technique offers the following
Forget " 3D stacking " -- the two companies say a special electronic "glue" applied to the wafer will help stack dozens of chips into a "silicon skyscraper" that will be much faster and more efficient than current chip technology.