3d Stacked Ics
3d Stacked Ics news and technical articles from Solid State Technology Magazine. Search 3d Stacked Ics latest and archived news and articles
-
3D stacked IC design flow gets boost from imec, Atrenta partnership
… planning and partitioning design flow for heterogeneous 3D stacked ICs . Cost-effective, rapidly ramping 3D ICs require ..... their first EDA tool flow for 3D design at DAC 2010. 3D stacked ICs reduce package footprint, and offer shorter and faster …
-
World News
… say they have developed a design-for-test and automatic test pattern generation technology to more easily test 3D stacked ICs with through-silicon via (TSV) functionality, adding only "negligible" area costs. Elpida , Powertech , and …
-
IMEC, Cadence automate 3D IC design test
… say they have developed a design-for-test and automatic test pattern generation technology to more easily test 3D stacked ICs with through-silicon via (TSV) functionality, adding only "negligible" area costs. The 3D DFT architecture …
-
Imec brings new device architecture results to SEMICON West
… design automation (EDA) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs . Imec purposefully designed the stack to closely resemble future commercial chips: using imec's proprietary logic …
-
Imec ITF: The next wave of applications, with chips designed in 3D
… is one of the research centers where 3D integration was pioneered. The technology flavor developed was 3D-SIC ( 3D stacked ICs ), where dies are interconnected through the silicon with so-called TSVs ( through-silicon vias ). 3D SIC technology …
