3d Stacked Ics
3d Stacked Ics news and technical articles from Solid State Technology Magazine. Search 3d Stacked Ics latest and archived news and articles
-
Design Platform for 3D Stacked ICs
The j360 Silicon PathFinder 3D Platform from Javelin Design Automations supports 3D stacked IC design using through silicon vias (TSV). The design tool reportedly extends the Javelin PathFinding methodology and j360 Silicon PathFinder platform to support virtual chip design for co-optimization of
-
3D stacked IC design flow gets boost from imec, Atrenta partnership
… planning and partitioning design flow for heterogeneous 3D stacked ICs . Cost-effective, rapidly ramping 3D ICs require ..... their first EDA tool flow for 3D design at DAC 2010. 3D stacked ICs reduce package footprint, and offer shorter and faster …
-
Economics may drive push to 3D ICs, says SEMATECH's Arkalgud
… Director, Solid State Technology May 21, 2008 - Beyond today's stacked chips in a package may come higher performance 3D stacked ICs using through-silicon vias (TSV) to interconnect layers, according to Sitaram Arkalgud, who spoke on the economic …
-
Focus on 3D TEST at IEEE Workshop
The test community is embracing 3D ICs, as evidenced by presentations at the first IEEE International Workshop on Testing 3D stacked ICs that addressed a range of test challenges and solutions, reports Dr. Phil Garrou.
-
IMEC research energetically stacks up
Advanced Packaging 's Gail Flower reports from presentations at IMEC's recent annual research review, centering on two areas of predicted high growth: 3D stacked ICs including through-silicon vias (TSV), and crystalline Si and organic solar cells.
-
IMEC research energetically stacks up
Advanced Packaging 's Gail Flower reports from presentations at IMEC's recent annual research review, centering on two areas of predicted high growth: crystalline Si and organic solar cells, and 3D stacked ICs including through-silicon vias (TSV).
-
SEMICON West 2013 to address industry R&D challenges and opportunities
… latest updates on lithography scaling and productivity, processing requirements for nonplanar transistors, 2.5/ 3D stacked ICs , and 450mm wafer processing. ITRS Public Sessions: The most critical technology innovation targets as identified …
-
EVG's wafer bonder passes SEMATECH/ISMI 3D integration tool assessment
… bonding. “The EVG GEMINI system provides the technical basis to enable wafer-to-wafer integration for producing 3D stacked ICs . The temporary and permanent wafer bonding processes enable via-middle and via-last through-silicon-via (TSV …
-
World News
… say they have developed a design-for-test and automatic test pattern generation technology to more easily test 3D stacked ICs with through-silicon via (TSV) functionality, adding only "negligible" area costs. Elpida , Powertech , and …
-
IMEC, Cadence automate 3D IC design test
… say they have developed a design-for-test and automatic test pattern generation technology to more easily test 3D stacked ICs with through-silicon via (TSV) functionality, adding only "negligible" area costs. The 3D DFT architecture …
