3d Semiconductor
3d Semiconductor news and technical articles from Solid State Technology Magazine. Search 3d Semiconductor latest and archived news and articles
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CEA-Leti launches 3D semiconductor packaging platform
… corresponding to the initial technical requirements of Leti customers. Figure 1. The Open-3D offer from CEA-Leti. 3D semiconductor packaging can offer performance, form factor, and cost benefits to bio/medical, aeronautics and space, consumer applications …
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Optomec expands aerosol jet lab for 3D semiconductor packaging, PV, other device formation
… enhance performance of current electronic devices, as well as to enable the creation of next generation products, such as 3D semiconductor packaging , high efficiency solar cells and solid oxide fuel cells . Also read: Optomec aerosol jet printing featured …
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AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab
Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore’s Science Park II with its partner in the endeavor, A*STAR.
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Georgia Tech targets thin 3D packaging with new consortium
… Georgia Institute of Technology (Georgia Tech) Packaging Research Center (GT-PRC) proposes a new consortium on 3D semiconductor packaging called 3D ThinPack (THInPack) for ultra-miniaturized 3D heterogeneous, RF, digital and power modules in …
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Silicon Genesis wafering tool designed for solar, LED, packaging sectors
… system for fabricating thin-silicon solar wafers, as well as high-brightness light-emitting diode (HB-LED) , and 3D semiconductor packaging wafers. The system tailored for silicon, GaAs, germanium, SiC, GaN and sapphire materials. The new GenII …
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Shin-Etsu Chemical joins EVG wafer bonding supply chain
… Shin-Etsu Chemical Co. Ltd. into its open platform for temporary bonding/debonding (TB/DB) materials supporting 3D semiconductor packaging . Shin-Etsu will work with customers to commercialize 3D IC packaging via wafer bond/debond in volume manufacturing …
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ULVAC CVD-Co, -Ni system suits 3D gate, MEMS fab
… ULVAC Inc. developed the ENTRONTM-EX2 W300 CVD-Ni/CVD-Co system for CVD-Ni and CVD-Co silicidation of 3D semiconductor gates and MEMS . The system is a response to a semiconductor industry transition from PVD to CVD in advanced 3D gate structure …
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TSV zen comes down to wafer processing balance
July 26, 2011 -- 3D semiconductor packaging processes involve various groups, and standards are important in the hand-offs between them, explains Mark Berry …
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SEMATECH creates 3D packaging standards development forum
November 7, 2011 -- SEMATECH has created an online 3D Standards Dashboard, allowing 3D semiconductor and MEMS interconnect professionals to exchange standards activity information. This Dashboard, managed by SEMATECH's 3D Enablement …
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SEMATECH survey on 2.5D, 3D IC; gaps in the via-mid ecosystem
… July 13 at 1:50PM]). Arkalgud discusses the high-volume manufacturability issues and gaps in both 2.5D and 3D semiconductor technologies with respect to backside processing and wafer bonding, thinning, and handling. The figure is a summary …
