3d Semiconductor
3d Semiconductor news and technical articles from Solid State Technology Magazine. Search 3d Semiconductor latest and archived news and articles
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CEA Leti deploys EVG's litho, packaging tools for 300mm line
… bonding. These lithography and packaging systems were specifically chosen for the advantages they deliver in 3D semiconductor package processing. CEA-Leti will be able to tap EVG's extensive process know-how in 3D integration and through …
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CEA-Leti launches 3D semiconductor packaging platform
… corresponding to the initial technical requirements of Leti customers. Figure 1. The Open-3D offer from CEA-Leti. 3D semiconductor packaging can offer performance, form factor, and cost benefits to bio/medical, aeronautics and space, consumer applications …
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Optomec expands aerosol jet lab for 3D semiconductor packaging, PV, other device formation
… enhance performance of current electronic devices, as well as to enable the creation of next generation products, such as 3D semiconductor packaging , high efficiency solar cells and solid oxide fuel cells . Also read: Optomec aerosol jet printing featured …
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AMAT, Singapore's microelectronics institute open 3D semiconductor packaging R&D lab
Applied Materials Inc. (AMAT) opened the new Centre of Excellence in Advanced Packaging at Singapore’s Science Park II with its partner in the endeavor, A*STAR.
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EDA in a 3D semiconductor world: Walden Rhines
Walden Rhines, Mentor Graphics, discusses 3D technologies. The EDA tools need to be extended to meet the needs of 3D -- parasitic extraction and timing, place-and-route, and other steps are different with 3D. The tools are evolving for the various 3D technologies. He also touches on lithography ...
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EDA in a 3D semiconductor world: Walden Rhines
In this video interview from SEMICON West 2010, Walden Rhines, Mentor Graphics, discusses 3D technologies. EDA tools need to be extended to meet the needs of 3D -- parasitic extraction and timing, place-and-route, and other steps are different with 3D. The tools are evolving for the various 3D ...
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Achieving cost and performance goals using 3D semiconductor packaging
It has been proven that SoC and 3D multiple die packaging can significantly improve performance and the function-to-area ratio, however, one must look at the tradeoffs. Vern Solberg, STC-Madison, Madison, WI USA
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Achieving cost and performance goals using 3D semiconductor packaging
It has been proven that SoC and 3D multiple die packaging can significantly improve performance and the function-to-area ratio, however, one must look at the tradeoffs. Vern Solberg, STC-Madison, Madison, WI USA
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NuPGA becomes MonolithIC 3D, expands IP in monolithic 3D semiconductor space
As it developed an improved FPGA technology, the NuPGA team discovered a path for practical monolithic 3D ICs. MonolithIC 3D changed its strategy to focus on monolithic 3D IC technology as a pure IP innovator organization.
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2.5/3D interposers fabbed at 30% lower COO with USHIO’s large-field lithography stepper
… field stepper lithography tool “UX7-3Di LFS 200” at SEMICON West, targeting interposer fabrication for 2.5D/ 3D semiconductor packaging applications. More SEMICON West product previews: Metrology, inspection, and process control products …
