Packaging
Packaging news and technical articles from Solid State Technology Magazine. Search Packaging latest and archived news and articles
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3D Packaging — How to Build 3D Packages from Design through Materials & Equipment
adapted for print by AP editors This article is the second in a series on 3D packaging technology, and summarizes information presented during a December 2007 webcast produced and hosted by Advanced Packaging magazine. Participants included: Dan Schmauch and Rozalia Beica, Semitool Inc.; Jean-Marc ...
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Advantest tackles 3D package test with new product line
… solutions for through silicon via (TSV)-based 2.5D and 3D packages . The concept model test cell, DIMENSION, integrates a ..... available at www.advantest.co.jp Learn more about 2.5D/ 3D packaging technology developments in our report from The ConFab: 3D …
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3D packaging issues for ultrasmall systems-in-a-cube
… always have limitations on well ordered interconnects. Folded 3D packages are basically 2D flexible interconnects, folded in the third ..... sensors and other functions for additional applications. This 3D package differs from existing alternatives in that it fully exploits …
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Multitest releases 3D packaging test combination for sensitive bare die
… process test of stacked dies during the assembly process of 3D packages . The hardware set up comprises a Multitest InStrip3D, a test ..... www.multitest.com/openhouse ). High parallel test of 3D packages also will be part of the presentation given by Bernhard Lorenz …
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Cooling 3D Packages with Thin-film Thermoelectrics
… higher processor speeds as the line sizes of the devices themselves continue to shrink. The electronics industry is moving to 3D packaging structures which will shorten the electrical path length, thereby allowing for higher transmission speeds. Of course …
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Amkor licenses 3D packaging tech to SHINKO
… service. Last year, Amkor surpassed 100 million units of its TMV products fabricated . The technology provides SHINKO with a 3D package stacking process for package on package (PoP) components. With TMV, a blind via is created through the mold compound after …
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Georgia Tech targets thin 3D packaging with new consortium
… digital Si and RF GaAs die embedding. Building on these advances, GT-PRC’s next consortium on 3D ThinPack will address 3D package stacking beyond conventional PoP, leading to ultra-thin stacked modules; ultra-fine pitch and low profile package …
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Designing Modern 3D Packages with Mixed Technology Content
… technology content such as high speed digital, analog, and RF. At the same time, density requirements force the use of 3D packaging technologies. As prototypes are a relic of the past when it comes to packaging design, early planning/evaluation, parasitic …
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Synopsys launches 3D packaging EDA line-up
… combining several products into a 3D-IC initiative for semiconductor designers moving to stacked-die silicon systems in 3D packaging . The 3D-IC initiative will bring in leading IC design and manufacturing companies to work with Synopsys on a comprehensive …
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Lack of EDA tools, thermal issues impeding 3D packaging technology
… interposer packaging technologies and supply chain, and 3D packaging technology and the ecosystem. He shared his thoughts on ..... chip/package interactions). In going from 2.5D to 3D packaging technology, Huemoeller explained that the industry needs …
