Packaging
Packaging news and technical articles from Solid State Technology Magazine. Search Packaging latest and archived news and articles
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Georgia Tech targets thin 3D packaging with new consortium
… digital Si and RF GaAs die embedding. Building on these advances, GT-PRC’s next consortium on 3D ThinPack will address 3D package stacking beyond conventional PoP, leading to ultra-thin stacked modules; ultra-fine pitch and low profile package …
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Amkor licenses 3D packaging tech to SHINKO
… service. Last year, Amkor surpassed 100 million units of its TMV products fabricated . The technology provides SHINKO with a 3D package stacking process for package on package (PoP) components. With TMV, a blind via is created through the mold compound after …
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Synopsys launches 3D packaging EDA line-up
… combining several products into a 3D-IC initiative for semiconductor designers moving to stacked-die silicon systems in 3D packaging . The 3D-IC initiative will bring in leading IC design and manufacturing companies to work with Synopsys on a comprehensive …
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Lack of EDA tools, thermal issues impeding 3D packaging technology
… interposer packaging technologies and supply chain, and 3D packaging technology and the ecosystem. He shared his thoughts on ..... chip/package interactions). In going from 2.5D to 3D packaging technology, Huemoeller explained that the industry needs …
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The Fabless/Foundry Supply Chain
… it is the field of 3D packaging that requires attention ..... Perspective," Yu noted that 3D packaging creates thin, small ..... long battery life. All 3D packages create better form factors ..... options to create a 3D package , however, are myriad …
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ITRI brings 3D packaging expertise to Rambus partnership
… is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies . Initially, the companies will collaborate on the development of system integration using silicon interposer …
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NCCAVS on 3D packaging : Bring on the TSVs
… Seventy attendees comprised the standing room only crowd at SEMI's HQ for the special June 15 NCCAVS user group meeting on 3D Packaging , co-hosted by three of the Bay Area User Groups: CMP, Plasma Applications, and Thin Film. The presentations will be …
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Inside Leti: FDSOI, 3D packaging , Si photonics work
… CEO of Leti, described the research group's work and the outlook on fully depleted silicon on insulator (FDSOI), 3D packaging technologies, and integrated photonics on silicon ( Si photonics ), in a video interview at SEMICON West 2011. Malier …
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Lithography challenges for leading edge 3D packaging applications
… CMOS Image Sensor Market Set for Steady Growth," EE Times , May 13, 2011. 2. Doe, P., "Elpida Looks to TSV," 3D Packaging , 14 , February 2010. 3. TechSearch International, "Through Silicon Via Technology," January 2008. 4. Flack, W …
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TEL's 3D packaging tool suite unveiled
… 2011 -- Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS through silicon via (TSV) deep ..... the wafer bonder/debonder Synapse equipment Series for 3D packaging . It coats and bakes materials, and uses high-speed wafer …
