3d Interconnect
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SEMATECH, TEL partner for 3D interconnects
… and Tokyo Electron Limited (TEL) have entered into a multiyear joint development program to improve prospects for using 3D interconnect technology and high-mobility channel materials in advanced semiconductor manufacturing, both sides said today in a statement …
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Technologists Investigate Challenges for 3D Interconnect Metrology
… enhanced to measure and improve 3D interconnect processes, SEMATECH will host a workshop dedicated to 3D interconnect metrology on July 15 in conjunction ..... share real metrology results from 3D interconnect processing, discuss metrology …
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Hynix Semiconductor joins SEMATECH 3D Interconnect Program at UAlbany NanoCollege
… has become a member of SEMATECH's 3D Interconnect program at the College of Nanoscale ..... collaborate with engineers in SEMATECH's 3D Interconnect program at CNSE's Albany NanoTech ..... global collaboration, SEMATECH's 3D Interconnect program emphasis is on exploring 3D …
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CEA/Leti, Alcatel forge DRIE pact for 3D interconnects
… industrial process capability" for silicon micro-vias using Alcatel's deep reactive ion etch (DRIE) tools for 3D interconnects . The two-year program aims to develop and demonstrate "turnkey solutions" for integration in advanced electronic systems …
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Lithography, 3D interconnects top SEMATECH 2005 to-do list
… silicon, SOI, and double-gate MOSFETs; - Interconnects, focusing on low- k dielectrics and process compatibility, and 3D interconnects ; - Metrology, manufacturing effectiveness and productivity, and environment, safety, and health issues. "Each of …
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IITC PREVIEW: Are 3D interconnects ready for prime time?
… involve 3D chip architectures. Sitaram Arkalgud, director of SEMATECH's interconnect division and its newly created 3D interconnect initiative , calls 3D chip architecture his "new religion," because stacked chips allow interconnects to be much shorter …
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June 2007 Exclusive Feature 2: 3D INTERCONNECTS IITC PREVIEW: Are 3D interconnects ready for prime time?
… involve 3D chip architectures. Sitaram Arkalgud, director of SEMATECH's interconnect division and its newly created 3D interconnect initiative, calls 3D chip architecture his "new religion," because stacked chips allow interconnects to be much shorter …
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TEL Joins SEMATECH's 3D Interconnect Program
(November 9, 2007) TOKYO, Japan & ALBANY, NY Tokyo Electron Ltd. (TEL) has become the first semiconductor supplier company to join SEMATECH's 3D Interconnect Program, teaming with several chipmakers who are the program's founding members. TEL's agreement with SEMATECH adds significant resources ...
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TEL first toolmaker in SEMATECH's 3D interconnect program
November 8, 2007 - Tokyo Electron Ltd. (TEL) has joined SEMATECH's 3D Interconnect Program, the first supplier in the group launched in 2005 to evolve traditional copper/low- k interconnect technology to 3D …
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TEL is first toolmaker in SEMATECH's 3D Interconnect program
November 12, 2007 -- 3D Interconnect Program , the first supplier in the group launched in 2005 to evolve traditional copper/low-k interconnect technology to 3D …
