3d Interconnect
3d Interconnect news and technical articles from Solid State Technology Magazine. Search 3d Interconnect latest and archived news and articles
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SEMICON West workshop addresses stress management for 3D ICs using TSVs
… is required at the product level to managing stress in 3D interconnects , and to drive consensus and support for these techniques ..... limiting degradation kinetics. SEMATECH is hosting a 3D Interconnect wiki site to provide a forum to the community to discuss …
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SEMATECH highlights from VLSI-TSA
… bonding interconnect approach for 2.5D and 3D integration was introduced by Sitaram Arkalgud, director of SEMATECH’s 3D interconnect program. Arkalgud revealed SEMATECH’s copper-to-copper direct bonding (CuDB) technology that can scale chip-to …
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Optomec enhances printing module for high-volume printed electronics fab
… extensive pilot testing with numerous customer sites for the Marathon Series. The printer performed fine-line printing of 3D interconnects , printing of dielectrics, and deposition of wide-area coatings. The Marathon series complements current Aerosol Jet …
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Lack of EDA tools, thermal issues impeding 3D packaging technology
August 10, 2011 - Ron Huemoeller, SVP of advanced 3D interconnects at Amkor, participated in two panels at SEMICON West 2011 : 2.5D silicon interposer packaging technologies and supply chain …
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EV Group joins Ga. Tech's 3D packaging center
… statement. EVG was a cofounder of the EMC-3D consortium back in 2006 to address the technical and cost issues of creating 3D interconnects using through-silicon vias (TSV) for chip stacking and MEMS/sensors packaging; that group, having met its goal …
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Interposer ecosystem examined
… VP of electronic packaging technologies at Hynix; Rich Rice, Sr. VP of sales for ASE ; Ron Huemoeller, VP of Advanced 3D interconnect at Amkor; Matt Nowak, Sr. Director of Engineering at Qualcomm and Jan Vardaman, President of TechSearch Inc. The panelists …
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Interposer supply/ecosystem examined at IMAPS Device Packaging
… VP of electronic packaging technologies at Hynix; Rich Rice, Sr VP of sales for ASE ; Ron Huemoeller, VP of Advanced 3D interconnect at Amkor; Matt Nowak, Sr Director of Engineering at Qualcomm and Jan Vardaman, President of TechSearch Inc. Photo …
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Advanced package technologies' growth through 2015
… demand market. Stacked package revenue will experience a 10% compound annual growth rate (CAGR) through 2015. TSVs/ 3D interconnect creates a die stack with short interconnection distance for high speed, low power consumption, reduced parasitics, and …
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EVG doubles process module space in XT Frame platform
… and serviceability are reportedly improved. "Greater-volume manufacturing" is a trend for advanced packaging and 3D interconnect , which led EVG to launch the XT Frame equipment platform on its EVG850TB/DB system, said Paul Lindner, executive technology …
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Thin-wafer bond/debond metrology from EVG opens process control, supply chain possibilities
… director, will present "In-line IR metrology for high-volume temporary bonding applications" at the SEMATECH Workshop on 3D Interconnect Technology, July 13, 2011, in San Francisco, CA. EV Group (EVG) provides wafer processing products for semiconductor …
