3d Die
3d Die news and technical articles from Solid State Technology Magazine. Search 3d Die latest and archived news and articles
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GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die
… special set of semiconductor production tools to create through-silicon vias (TSV) in 20nm node semiconductor wafers . 3D die stacking of leading-edge chips will enable mobile and consumer electronics. The first full-flow silicon with TSVs …
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Advantest tackles 3D package test with new product line
… packages . The concept model test cell, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities. The concept test cell solution will be designed for die handling, test, and production …
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Vertical-die-stacking-goes-3D-without-TSV
… Andrew Smith, Ventmark Technology Solutions, presents a 3D die stacking technology to address package miniaturization ..... VI) structures are a key element in the architecture of 3D die stacks, providing mechanical support within the stack and …
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STATS ChipPAC readies R&D site in Singapore
… Singapore, to develop next-generation technologies including through-silicon vias (TSV), microbump bonding methods for 3D die , silicon substrate-based system-in-package solutions, and embedded active die technology. The new facility includes …
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Fraunhofer, EVG develop temporary wafer bonding for thicker die
… associated with bad die. Also, heterogeneous technologies (different sizes, feature dimensions, etc.) can be bonded in 3D die stacks with a broad range of functionality (logic, memory, mixed signal, photonics, etc.) in a compact form factor …
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3D Integration: The Challenges Ahead
… returns – at least for high-end or long-running apps. For other products having a relatively short life cycle, 3D die stacking or package stacking will have a decisive advantage in both time and economics. On our website, an online feature …
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The road ahead for SiPs
… organizations are investigating solutions to switch optical signals within a package, distributing these signals through a 3D die stack, as well as from package to package. Glass substrates have emerged as a strong candidate for such applications [2 …
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3D Integration: The Challenges Ahead
… returns – at least for high-end or long-running apps. For other products having a relatively short life cycle, 3D die stacking or package stacking will have a decisive advantage in both time and economics. On our website, an online feature …
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Wafer bonding: Many options for many devices
… will grow significantly for the next year. The growth will be driven small-size wafers for LEDs and 12" wafers for 3D die stacking and CIS. The wafer bonding market is a very complex one, crossing different wafer sizes (from 2" to 12 …
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The road ahead for SiPs
… organizations are investigating solutions to switch optical signals within a package, distributing these signals through a 3D die stack, as well as from package to package. Glass substrates have emerged as a strong candidate for such applications [2 …
