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(June 2, 2009) RESEARCH TRIANGLE PARK, NC The 2009 3D Architectures for Semiconductor Integration and Packaging Conference and Exhibition will bring together industry leaders to examine the practical
Symposium: Key Topics in Going 3-D The Evolving 3-D IC Infrastructure Test in the Third Dimension Thermal Management of 3D Architectures : Challenges and Opportunities Taiwan R&D for 3-D ICs Visit http://techventure.rti.org/Winter2010 for more
The 22nm node marks the beginning of a major transition from conventional scaling of planar memory devices to complex 3D architectures . SEMATECH authors examine the metrology needs of 3D memory device architectures in Part 2 of this three-part series.
Research Triangle Park, NC — The third annual " 3D Architectures for Semiconductor Integration and Packaging" conference, held by RTI International, will convene in San Francisco, CA, on October 31–November 2, 2006.
manufacturing. Dr. Daniel Josell, NIST, discusses how 3D architecture is used to achieve lateral carrier separation, and back ..... 27-29, 2011, San Francisco, CA). He noted that 3D architecture is used to achieve lateral carrier separation and back
explore the path that interconnect technology must take to keep pace with transistor scaling and the transition to new 3D architectures . ” (emphasis added) This had been illustrated before in the following chart: And to make it crystal clear, IBM presented
and lower supply voltage requirements than planar devices. To continue to scale with Moore’s law, devices having 3D architectures will enter manufacturing in 2012 at the 22nm node. Metrology demands for 3D structures and their more complex integration
stack element. Imec also made significant progress in advanced FLASH engineering using alternative high -k materials and 3D architectures . imec has 4 papers on reliability issues of power devices and CMOS devices, and 4 papers on 20-14nm next-generation
resulted in a very robust 3D IC standards foundation in place for the manufacturing issues that need to be addressed to enable 3D architectures to prosper efficiently and effectively. “If we go into every system becoming a unique requirement, there will be delays
models and without new form factors the industry would stagnate. The latest edition of the ITRS notes that the expansion of 3D architectures for packaging poses unique challenges that are not encountered in conventional 2D packaging. These include: Thinning