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3d Architecture

3d Architecture news and technical articles from Solid State Technology Magazine. Search 3d Architecture latest and archived news and articles

  1. Semiconductor metrology beyond 22nm: 3D memory metrology

    Article

    Thu, 16 Feb 2012

    The 22nm node marks the beginning of a major transition from conventional scaling of planar memory devices to complex 3D architectures . SEMATECH authors examine the metrology needs of 3D memory device architectures in Part 2 of this three-part series.

  2. Evolution or revolution: the path for metrology beyond the 22nm node

    Article

    Thu, 1 Mar 2012

    and lower supply voltage requirements than planar devices. To continue to scale with Moore's law, devices having 3D architectures will enter manufacturing in 2012 at the 22nm node. Metrology demands for 3D structures and their more complex integration

  1. Semiconductor metrology beyond 22nm: FinFET metrology

    Article

    Thu, 9 Feb 2012

    and lower supply voltage requirements than planar devices. To continue to scale with Moore’s law, devices having 3D architectures will enter manufacturing in 2012 at the 22nm node. Metrology demands for 3D structures and their more complex integration

  2. imec's IEDM papers reach "record number"

    Article

    Wed, 7 Dec 2011

    stack element. Imec also made significant progress in advanced FLASH engineering using alternative high -k materials and 3D architectures . imec has 4 papers on reliability issues of power devices and CMOS devices, and 4 papers on 20-14nm next-generation

  3. SEMI says innovation is in, expensive differentiation is out

    Article

    Mon, 23 May 2011

    resulted in a very robust 3D IC standards foundation in place for the manufacturing issues that need to be addressed to enable 3D architectures to prosper efficiently and effectively. “If we go into every system becoming a unique requirement, there will be delays

  4. Silicon interposers: building blocks for 3D-ICs

    Article

    Wed, 1 Jun 2011

    nodes. Silicon interposers were once viewed as an "interim" technology to help designers realize many of the benefits of 3D architecture , while delaying the most difficult production issues associated with TSVs. They now seem set to stay as a valid alternative

  5. Tessera focuses on semiconductor technologies beyond packaging

    Article

    Thu, 7 Apr 2011

    consist of approximately 40 current employees located in San Jose. Their focus will be on circuitry design, memory modules, 3D architecture , and advanced interconnect technologies, among other areas. Tessera also announced that it is exploring a possible separation

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