3-D Ic
3-D Ic news and technical articles from Solid State Technology Magazine. Search 3-D Ic latest and archived news and articles
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Silicon interposers: building blocks for 3D-ICs
… driving the adoption of 3D - IC designs. What technology ..... be needed to make 3D - ICs a market reality at ..... of the benefits of 3D - ICs with fewer design ..... OR USA A complete 3D - IC implementation is ..... http://www. 3d - ic .org/documents ..... Robust Verification of 3D - ICs : Pros, Cons and …
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SEMICON West workshop addresses stress management for 3D ICs using TSVs
… solution for managing stress. In conjunction with SEMICON West, SEMATECH and Fraunhofer IZFP hosted "Stress management for 3D ICs using through silicon vias: Product-level reliability workshop" to address product level considerations for dealing with …
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Integration and 3D -ICs driving developments in wafer bonding
… alignment accuracy. At the IEEE 3D IC Conference in 2010, Soitec ..... Heterogeneous integration and 3D - ICs have driven the technical ..... heterogeneous integration and 3D - ICs . Acknowledgments Gemini ..... integration," Proc. IEEE 3D - IC Conf., München, 2010 …
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Graphene races CNT for nanomaterial commercialization
… applications. Brewer Science’s CNTRENE carbon nanotube material was developed for semiconductor, advanced packaging/ 3 - D IC , MEMS, display, LED, and printed electronics applications. Dr Philip Wallis, SWeNT, will discuss proprietary V2V …
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Invensas, Allvia ink 3D IC tie-up
… transfer and collaborative development of 3D IC packaging technology, though the description ..... patents from Allvia, mostly involving 3D ICs and packaging -- namely through ..... further develop technology and IP in 3D IC packaging. Here's what we know from …
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3D IC prototyping process result of MENT, Tezzaron, MOSIS collaboration
… economically developing and manufacturing 3D - IC prototypes on multi-project wafers (MPWs ..... allow users, via Tezzaron, to test out 3D - IC concepts using the same provider and model ..... customer designs as required for successful 3D - IC integration and also provides backend manufacturing …
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3D IC with TSV show significant advances in last 12 months
… confusion with other "3D" technologies, 3D IC integration has been making significant ..... 3D for TV (stereoscopic 3D) and " 3D IC " (the latest name for Intel's finFET ..... that next generaton designs will move to 3D IC with TSV because they will be the low cost …
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Thermal modeling software aids 3D IC , SoC, SiP designs
… analysis software supplier, released AceThermalModeler (ATM) for generating compact thermal models of system on chips (SoCs), 3D ICs , systems in package (SiP) devices , and complete boards. Compact thermal models enable early system floorplan exploration …
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Elpida, PTI, UMC finalize 3D IC partnership
… plans announced a year ago , Elpida and Powertech Technology and UMC have finalized their partnership to develop a "one-chip" 3D IC solution incorporating logic+DRAM interface design, through-silicon via (TSV) formation, wafer thinning, testing, and …
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SUSS MicroTec sends equipment to SVTC in MEMS, 3D IC dev partnership
… Technologies partnered with SUSS MicroTec on wafer-level packaging (WLP) for micro electro mechanical systems (MEMS) and 3D IC bonding. The companies will focus on developing "new processes and solutions in the field of wafer-level packaging," said …
