Henkel is the world's leading and most progressive provider of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
Thin is definitely in, but what our modern flip chip devices really want is to be flat and happy! As flip chip die have become increasingly thinner in recent years, the ability to control package warpage –i.e. maintain a relative degree of “flatness” -- has become more and more challenging. And, it’s not just the die that are getting thinner: substrates also have much lower profiles than ever before and balancing these conditions can be tough, especially if you don’t have the right materials.