William Chen (Bill) is a Fellow of ASE, where he currently holds the position of Senior Technical Advisor at ASE (U.S.) Inc. Prior to joining the ASE Group, Bill was Director of the Institute of Materials Research & Engineering (IMRE), located in the National University of Singapore. Previously, Bill worked for over thirty three years performing various R&D and management positions at IBM Corporation, where he was elected to the IBM Academy of Technology. He is currently the co-chair of the International Technology Roadmap for Semiconductors (ITRS) Assembly and Packaging International Technical Working Group. Bill has been an associate editor of the IEEE/CPMT transactions, and ASME Journal of Electronic Packaging, and has published extensively in the fields of microelectronics packaging and mechanics of materials. He held the position of President of the IEEE Components Packaging and Manufacturing Technology Society (CPMT) from 2006-2009. Bill has been elected a Fellow of IEEE and a Fellow of ASME. In 2011, he was awarded the University Medal from Binghamton University.
Bill held adjunct faculty appointments at Cornell University, Binghamton University, University of Washington, and a visiting faculty appointment at Hong Kong University of Science of Technology. He received his B.Sc. at University of London, M Sc at Brown University and PhD at Cornell University.